Investigation into Stress Relief of Epoxy Resin Packaging Materials Based on Covalent Adaptable Networks Rearrangement

Bo Zhou; Zhi-hao Wang; Peng Zhou; Xin-xing Zhang

doi:10.11777/j.issn1000-3304.2025.25231

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Investigation into Stress Relief of Epoxy Resin Packaging Materials Based on Covalent Adaptable Networks Rearrangement

Research Article | 更新时间：2025-12-18

- Investigation into Stress Relief of Epoxy Resin Packaging Materials Based on Covalent Adaptable Networks Rearrangement
- Acta Polymerica Sinica Vol. 56, Issue 12, Pages: 2441-2451(2025)
- 作者机构：
  
  四川大学高分子研究所四川大学先进高分子材料全国重点实验室成都 610065
- 作者简介：
  
  Xin-xing Zhang, E-mail: xxzwwh@scu.edu.cn
- 基金信息：
- DOI：10.11777/j.issn1000-3304.2025.25231
  CLC：
- CSTR：32057.14.GFZXB.2025.7470
- Received：02 September 2025，
  
  Accepted：26 September 2025，
  
  Published Online：12 November 2025，
  
  Published：20 December 2025
- 稿件说明：
移动端阅览
周博, 王之昊, 周鹏, 张新星. 基于共价自适应网络重排的环氧树脂封装材料应力释放研究. 高分子学报, 2025, 56(12), 2441-2451

Zhou, B.; Wang, Z. H.; Zhou, P.; Zhang, X. X. Investigation into stress relief of epoxy resin packaging materials based on covalent adaptable networks rearrangement. Acta Polymerica Sinica, 2025, 56(12), 2441-2451
周博, 王之昊, 周鹏, 张新星. 基于共价自适应网络重排的环氧树脂封装材料应力释放研究. 高分子学报, 2025, 56(12), 2441-2451 DOI： 10.11777/j.issn1000-3304.2025.25231. CSTR： 32057.14.GFZXB.2025.7470.

Zhou, B.; Wang, Z. H.; Zhou, P.; Zhang, X. X. Investigation into stress relief of epoxy resin packaging materials based on covalent adaptable networks rearrangement. Acta Polymerica Sinica, 2025, 56(12), 2441-2451 DOI： 10.11777/j.issn1000-3304.2025.25231. CSTR： 32057.14.GFZXB.2025.7470.

摘要

5G时代高功率电子器件的高集成微型化，要求封装材料兼具高导热、强黏附与高效应力释放能力. 然而，传统环氧树脂因高度交联网络易积聚内应力导致器件失效，严重制约了高端设备的发展. 为此，我们基于共价自适应网络(CANs)的动态拓扑重排特性，从分子结构设计出发设计了一种具有应力释放能力的高导热环氧树脂封装材料. 通过将一维碳纳米管与二维三氧化二铝微球进行协同互配，成功构建了三维导热网络，显著提升了材料的导热能力. 体系中引入的动态共价键与多重氢键产生协同效应，在实现环氧树脂内应力有效释放的同时，还大幅增强了其界面粘接强度与再加工性能. 高过载测试及环境老化实验结果表明，该材料在严苛工况下仍具备优异的服役可靠性. 本研究为发展新一代高性能电子封装材料提供了新的设计思路.

Abstract

In the 5G era

the high integration and miniaturization of high-power electronic devices require packaging materials to possess excellent thermal conductivity

strong adhesion

and efficient stress release capabilities. However

traditional epoxy resins suffer from the problem of internal stress accumulation due to their highly cross-linked network

which leads to device failure and severely restricts the development of high-end equipment. To address this issue

based on the dynamic topological rearrangement characteristics of covalent adaptive networks (CANs)

we designed a high thermal conductivity epoxy resin packaging material with efficient stress release capabilities starting from the molecular structure design. By synergistically matching one-dimensional carbon nanotubes with two-dimensional aluminum oxide microspheres

a three-dimensional thermal conduction network was successfully constructed

significantly enhancing the thermal conductivity of the material. The dynamic covalent bonds and multiple hydrogen bonds introduced in the system produced a synergistic effect

effectively releasing the internal stress of the epoxy resin while significantly enhancing its interface bonding strength and reprocessing performance. The results of high overload tests and environmental aging experiments demonstrated that this material still exhibits excellent service reliability under harsh conditions. This research provides a new design concept for the development of a new generation of high-performance electronic packaging materials.

关键词

Keywords

references

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