Black Polyimide Films: Structures, Properties, and Applications

De-zhi Zhan; Wan-ying Zhang; Zhen-xuan Huang; Hao Zhong; Jin-ru Li; Shi-long Zhong; Rui Chen; Cheng Wang; Xu-dong Chen

doi:10.11777/j.issn1000-3304.2025.25236

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Black Polyimide Films: Structures, Properties, and Applications

Review | 更新时间：2026-02-01

- Black Polyimide Films: Structures, Properties, and Applications
- Acta Polymerica Sinica Vol. 57, Issue 2, Pages: 339-364(2026)
- 作者机构：
  
  广东工业大学轻工化工学院广州 510006
- 作者简介：
- 基金信息：
- DOI：10.11777/j.issn1000-3304.2025.25236
  CLC：
- CSTR：32057.14.GFZXB.2025.7490
- Received：08 September 2025，
  
  Accepted：09 October 2025，
  
  Published Online：17 December 2025，
  
  Published：20 February 2026
- 稿件说明：
移动端阅览
占德志, 张婉莹, 黄振轩, 钟浩, 黎锦如, 钟世龙, 陈瑞, 汪成, 陈旭东. 黑色聚酰亚胺薄膜：结构、性能与应用. 高分子学报, 2026, 57(2), 339-364.

Zhan, D. Z.; Zhang, W. Y.; Huang, Z. X.; Zhong, H.; Li, J. R.; Zhong, S. L.; Chen, R.; Wang, C.; Chen, X. D. Black polyimide films: structures, properties, and applications. Acta Polymerica Sinica (in Chinese), 2026, 57(2), 339-364.
占德志, 张婉莹, 黄振轩, 钟浩, 黎锦如, 钟世龙, 陈瑞, 汪成, 陈旭东. 黑色聚酰亚胺薄膜：结构、性能与应用. 高分子学报, 2026, 57(2), 339-364. DOI： 10.11777/j.issn1000-3304.2025.25236. CSTR： 32057.14.GFZXB.2025.7490.

Zhan, D. Z.; Zhang, W. Y.; Huang, Z. X.; Zhong, H.; Li, J. R.; Zhong, S. L.; Chen, R.; Wang, C.; Chen, X. D. Black polyimide films: structures, properties, and applications. Acta Polymerica Sinica (in Chinese), 2026, 57(2), 339-364. DOI： 10.11777/j.issn1000-3304.2025.25236. CSTR： 32057.14.GFZXB.2025.7490.

摘要

黑色聚酰亚胺(black polyimide，BPI)作为一种新型关键材料，已在柔性有机电子领域崭露头角，尤其在电子器件和柔性集成线路板中应用前景广阔. 与传统聚酰亚胺相比，用于集成电路载板的黑色聚酰亚胺不仅保持了其固有的机械稳定性和热稳定性，更展现出丰富的功能性，包括卓越的光屏蔽能力、抗氧化性以及能有效保护电路设计免遭逆向工程破解. 这些特性使其成为有机电子器件的理想基底材料候选者. 尽管针对黑色聚酰亚胺的制备与应用已有广泛研究，但整合其多维度进展的系统性综述目前尚缺，相关领域的整体发展脉络尚未得到充分探讨. 此外，通过化学结构的分子工程学策略来改性聚合物性能已被广泛应用，这在新型高分子材料的设计与制备中尤为显著. 基于此，本综述聚焦于黑色聚酰亚胺的分子设计，通过融合增色原理与制备技术，系统评述其设计策略与研究进展. 最后，对黑色聚酰亚胺当前在制备与应用中面临的挑战及未来发展方向进行了探讨与总结.

Abstract

Black polyimide (BPI)

a novel critical material

has emerged prominently in the field of flexible organic electronics

showing broad application prospects

especially in electronic devices and flexible integrated circuit boards. Compared with traditional polyimides

black polyimides used in integrated

circuit carrier boards not only retain their inherent mechanical and thermal stability but also exhibit enriched functionality

including exceptional light-shielding capability

oxidation resistance

and effective protection of circuit designs against reverse engineering. These characteristics make it an ideal candidate substrate material for organic electronic devices. Although extensive research has been conducted on the preparation and application of black polyimides

a comprehensive and systematic review integrating multidimensional progress is still notably lacking

which hinders an in-depth understanding among researchers in this field. Furthermore

the strategy of molecular engineering

via

chemical structure modification to enhance polymer performance has been widely adopted

particularly in designing and preparing novel polymeric materials. Based on this

the present review focuses on the molecular design of black polyimides

systematically discussing their design strategies and research advancements by integrating chromogenic principles and preparation techniques. Finally

this review explores and summarizes the current challenges in the preparation and application of black polyimides

as well as future development directions.

关键词

Keywords

references

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