Development and Investigation of a High-performance, Low-shrinkage Dielectric Ink for 3D Printing

Bei-bei Su; Yong-quan Jiang; Ruo-tong Gao; Li-shuai Zong; Jin-yan Wang; Xi-gao Jian

doi:10.11777/j.issn1000-3304.2025.25268

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Development and Investigation of a High-performance, Low-shrinkage Dielectric Ink for 3D Printing

Research Article | 更新时间：2026-01-16

- Development and Investigation of a High-performance, Low-shrinkage Dielectric Ink for 3D Printing
- Acta Polymerica Sinica Vol. 57, Issue 1, Pages: 292-304(2026)
- 作者机构：
  
  大连理工大学高分子材料系大连 116024
- 作者简介：
  
  Li-shuai Zong, E-mail: zongls@dlut.edu.cn
- 基金信息：
- DOI：10.11777/j.issn1000-3304.2025.25268
  CLC：
- CSTR：32057.14.GFZXB.2025.7530
- Received：16 October 2025，
  
  Accepted：03 December 2025，
  
  Published Online：07 January 2026，
  
  Published：20 January 2026
- 稿件说明：
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苏贝贝, 蒋涌泉, 高若彤, 宗立率, 王锦艳, 蹇锡高. 高性能低收缩3D打印介电油墨的制备与性能. 高分子学报, 2026, 57(1), 292-304.

Su, B. B.; Jiang, Y. Q.; Gao, R. T.; Zong, L. S.; Wang, J. Y.; Jian, X. G. Development and investigation of a high-performance, low-shrinkage dielectric ink for 3D printing. Acta Polymerica Sinica (in Chinese), 2026, 57(1), 292-304.
苏贝贝, 蒋涌泉, 高若彤, 宗立率, 王锦艳, 蹇锡高. 高性能低收缩3D打印介电油墨的制备与性能. 高分子学报, 2026, 57(1), 292-304. DOI： 10.11777/j.issn1000-3304.2025.25268. CSTR： 32057.14.GFZXB.2025.7530.

Su, B. B.; Jiang, Y. Q.; Gao, R. T.; Zong, L. S.; Wang, J. Y.; Jian, X. G. Development and investigation of a high-performance, low-shrinkage dielectric ink for 3D printing. Acta Polymerica Sinica (in Chinese), 2026, 57(1), 292-304. DOI： 10.11777/j.issn1000-3304.2025.25268. CSTR： 32057.14.GFZXB.2025.7530.

摘要

随着3D打印技术的迅速发展及其应用领域的不断拓展，对成型件尺寸稳定性的要求日益提高. 然而，紫外(UV)快速固化过程中的体积收缩问题严重限制了该技术的应用. 本研究采用多种双官能度乙烯基醚单体——二乙二醇二乙烯基醚(DVE2)、三乙二醇二乙烯基醚(DVE3)、1

4-丁二醇二乙烯基醚(BDOVE)和1

4-二甲基环己烷二乙烯基醚(CHDM)，与聚氨酯丙烯酸酯(PUA)低聚物，以及活性稀释单体共混，通过自由基/阳离子混杂光固化体系构建三维网络结构，有效抑制了因应力集中引起的收缩. 乙烯基醚/丙烯酸酯混杂树脂体系表现出较低的固化收缩率. 其中，添加1

4-二甲基环己烷二乙烯基醚的PUA-CHDM树脂固化收缩率仅为7.31%，明显低于市售光敏树脂(约10%). 此外，该体系可在60 s内实现快速固化，并具备优异的机械性能(拉伸强度

70 MPa)和热稳定性(玻璃化转变温度

=227 ℃). 在15 GHz频率下，其介电常数(

)为2.72，介电损耗(

)为0.0159，选择PUA-CHDM为介电油墨通过与纳米银结合，打印出的电路导电性能良好. 本研究为高精度增材制造提供了一种集快速成型、高机械强度和优异介电性能于一体的光固化材料解决方案，在微电子封装和高频通信器件等精密制造领域显示出重要的应用前景.

Abstract

With the rapid advancement of 3D printing technology and its expanding application fields

there is an increasing demand for dimensional stability in printed components. However

volume shrinkage during UV rapid curing significantly limits the applicability of this technology. A series of bifunctional vinyl ether monomers—di(ethylene glycol) divinyl ether (DVE2)

tri(ethylene glycol) divinyl ether (DVE3)

4-butanediol divinyl ether (BDOVE)

and 1

4-cyclohexanedimethanol divinyl ether (CHDM)—were blended with a poly(urethane acrylate) (PUA) oligomer and reactive diluent monomers. A free radical/cationic hybrid photopolymerization system was employed to construct a three-dimensional network

effectively suppressing shrinkage induced by stress concentration. The vinyl ether/acrylate hybrid resin systems exhibited relatively low curing shrinkage. Among them

the PUA-CHDM resin incorporating 1

4-cyclohexanedimethanol divinyl ether showed a curing shrinkage of only 7.14%

which is significantly lower than that of commercial photocurable resins (≈10%). In addition

this system achieves rapid curing within 60 s

along with excellent mechanical properties (tensile strength

70 MPa) and high thermal stability (glass transition temperature

=227 °C). At 15 GHz

it exhibited a dielectric constant (

) of 2.72 and a dielectric loss (

) of 0.0159. The PUA-CHDM formulation was selected as a dielectric ink and combined with nano-silver to produce printed circuits with good electrical conductivity. This work provides a photopolymer solution for high-precision additive manufacturing that integrates rapid curing

high mechanical strength

and superior dielectric properties

demonstrating promising potential for applications in m

icroelectronic packaging and high-frequency communication devices.

关键词

Keywords

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