Preparation and Performance of Fast-curing High-performance Epoxy Resin Underfill

Hao-ming Guo; Jin-yan Wang; Xi-gao Jian

doi:10.11777/j.issn1000-3304.2026.26127

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Preparation and Performance of Fast-curing High-performance Epoxy Resin Underfill

更新时间：2026-07-14

- Preparation and Performance of Fast-curing High-performance Epoxy Resin Underfill
- Acta Polymerica Sinica Pages: 1-10(2026)
- 作者机构：
  
  大连理工大学高分子材料系大连 116024
- 作者简介：
  
  Jin-yan Wang, E-mail: wangjinyan@dlut.edu.cn
- 基金信息：
- DOI：10.11777/j.issn1000-3304.2026.26127
  CLC：
- CSTR：32057.14.GFZXB.2026.7653
- Received：19 April 2026，
  
  Accepted：05 June 2026，
  
  Online First：14 July 2026，
- 稿件说明：
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郭昊明, 王锦艳, 蹇锡高. 快速固化高性能环氧树脂底部填充胶的制备与性能. 高分子学报, doi: 10.11777/j.issn1000-3304.2026.26127.

Guo, H. M.; Wang, J. Y.; Jian, X. G. Preparation and performance of fast-curing high-performance epoxy resin underfill. Acta Polymerica Sinica (in Chinese), doi: 10.11777/j.issn1000-3304.2026.26127.
郭昊明, 王锦艳, 蹇锡高. 快速固化高性能环氧树脂底部填充胶的制备与性能. 高分子学报, doi: 10.11777/j.issn1000-3304.2026.26127. DOI： CSTR： 32057.14.GFZXB.2026.7653.

Guo, H. M.; Wang, J. Y.; Jian, X. G. Preparation and performance of fast-curing high-performance epoxy resin underfill. Acta Polymerica Sinica (in Chinese), doi: 10.11777/j.issn1000-3304.2026.26127. DOI： CSTR： 32057.14.GFZXB.2026.7653.

摘要

随着人工智能等领域的蓬勃发展，芯片的需求量大幅提升，而底部填充胶作为先进芯片封装生产过程的关键材料，较长的固化时间严重制约着生产效率的提升. 本研究将2种不同结构的脂环族环氧树脂，即3

4-环氧环己基甲基、3

4-环氧环己基甲酯(ERL-4221)与双(7-氧杂双环[4.1.0

]

3-庚甲基)己二酸酯(ERL-4299)同硫鎓盐固化剂(4-羟苯基)甲基(2-甲基苄基)硫鎓六氟锑酸盐共混，通过热阳离子固化体系显著降低了固化时间. 同时将2-(3

4-环氧环己基)乙基三甲氧基硅烷(KH-566)改性的球形二氧化硅作为填料加入，显著降低了填充胶的热膨胀系数(CTE). 所有体系均可实现在120 ℃下20 min内固化，其中，配方EP-60-B表现出优秀的热稳定性(玻璃化转变温度

=170 ℃，热分解5%温度

=386 ℃)和良好的流变性能(剪切速率为10 s

-1

时的黏度8.4 Pa·s). 在玻璃态区(

)时的CTE为38.9 ppm/℃，储能模量

'=3.46 GPa. 本研究提供了一种集快速固化、高耐热和低黏度于一体的底部填充胶材料解决方案，在先进电子封装领域显示出重要的应用前景.

Abstract

With the rapid development of fields such as artificial intelligence

the demand for chips has significantly increased. As a key material in the production process of advanced chip packaging

the thermal curing speed of bottom filling adhesive severely limits the improvement of production efficiency. This study employed two structurally distinct alicyclic epoxy resins—3

4-epoxycyclohexylmethyl 3

4-epoxycyclohexylcarboxylate (ERL-4221) and bis(7-oxabicyclo[4.1.0

]

3-heptylmethyl)adipate (ERL-4299)—along with a thiolane curing agent

(4-hydroxyphenyl)(2-methylbenzyl)thiolane hexafluoroantimonate

to significantly reduce curing time through a thermal cationic curing system. Additionally

spherical silica modified with 2-(3

4-epoxycyclohexyl)ethyltrimethoxysilane (KH-566) is incorporated as a filler

effectively lower

ing the thermal expansion coefficient (CTE) of the filling adhesive. All systems achieve curing within 20 min at 120 ℃

with Eq. (3) demonstrating outstanding thermal stability (glass transition temperature

=170 ℃

5% thermal decomposition temperature

=386 ℃) and excellent rheological properties (viscosity at a shear rate of 10 s

-1

was 8.4 Pa·s). In the glassy state (

)

the CTE is 38.9 ppm/℃

and the storage modulus

'=3.46 GPa. This research presents a bottom filling adhesive solution that integrates rapid curing

high heat resistance

and superior rheological performance

showing promising applications in advanced electronic packaging.

关键词

Keywords

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