Enhanced Thermal Conductivity of Polymer Composites Based on Dumbbell-like Filler Structures

Xiao-meng Zhou; Xue-ying Zhou; Zhi-xing Zhang; Meng-meng Qin; Wei Feng

doi:10.11777/j.issn1000-3304.2026.26142

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Enhanced Thermal Conductivity of Polymer Composites Based on Dumbbell-like Filler Structures

更新时间：2026-07-10

- Enhanced Thermal Conductivity of Polymer Composites Based on Dumbbell-like Filler Structures
- Acta Polymerica Sinica Pages: 1-13(2026)
- 作者机构：
  
  1.天津大学，材料科学与工程学院，天津 300350
  2.天津大学，贵金属功能材料全国重点实验室，天津 300350
- 作者简介：
  
  Meng-meng Qin, E-mail: qmm@tju.edu.cn
  Wei Feng, E-mail: weifeng@tju.edu.cn
- 基金信息：
- DOI：10.11777/j.issn1000-3304.2026.26142
  CLC：
- CSTR：32057.14.GFZXB.2026.7634
- Received：27 April 2026，
  
  Accepted：20 May 2026，
  
  Online First：10 July 2026，
- 稿件说明：
移动端阅览
周晓萌, 周雪颖, 张志兴, 秦盟盟, 封伟. 基于类哑铃结构填料增强聚合物复合材料导热性能. 高分子学报, doi: 10.11777/j.issn1000-3304.2026.26142.

Zhou, X. M.; Zhou, X. Y.; Zhang, Z. X.; Qin, M. M.; Feng, W. Enhanced thermal conductivity of polymer composites based on dumbbell-like filler structures. Acta Polymerica Sinica (in Chinese), doi: 10.11777/j.issn1000-3304.2026.26142.
周晓萌, 周雪颖, 张志兴, 秦盟盟, 封伟. 基于类哑铃结构填料增强聚合物复合材料导热性能. 高分子学报, doi: 10.11777/j.issn1000-3304.2026.26142. DOI： CSTR： 32057.14.GFZXB.2026.7634.

Zhou, X. M.; Zhou, X. Y.; Zhang, Z. X.; Qin, M. M.; Feng, W. Enhanced thermal conductivity of polymer composites based on dumbbell-like filler structures. Acta Polymerica Sinica (in Chinese), doi: 10.11777/j.issn1000-3304.2026.26142. DOI： CSTR： 32057.14.GFZXB.2026.7634.

摘要

高功率密度电子器件运行过程中产生的局部热积累会降低器件性能和服役可靠性，因此发展高效聚合物基热管理材料具有重要意义. 提高导热填料含量通常可有效改善聚合物基复合材料的导热性能，但过高的填料添加量往往会削弱材料的力学性能、电磁性能和绝缘性能等. 因此，在有限填料用量条件下提高其结构贡献和传热效能，对于聚合物基热管理复合材料导热性能的改善具有重要意义. 基于填料几何结构拓扑优化，建立了一种聚合物基复合材料导热性能提升策略，旨在通过合理调控填料构型提高其热贡献效率. 系统考察了迭代次数、体积分数、设计域几何形状和目标函数等因素对优化构型及传热性能的影响，在此基础上构建了一种简化的类哑铃填料结构. 与传统圆柱状填料结构相比，该结构表现出更优异的热响应特性，所制备的类哑铃阵列石墨/聚二甲基硅氧烷(graphite/polydimethylsiloxane，graphite/PDMS)复合材料散热效率为圆柱阵列graphite/PDMS复合材料的1.47倍. 相关结果为高性能聚合物基热管理复合材料的填料结构设计提供了有效方法.

Abstract

With the increasing power density of electronic devices

efficient thermal management is essential for improving device reliability. Polymer-based composites are promising thermal management materials because of their low density

good processability

and structural flexibility. However

the low intrinsic thermal conductivity of polymer matrices limits their heat dissipation capability. Increasing filler loading can improve heat conduction

but excessive filler content often deteriorates mechanical

electrical insulating

and processing properties. Therefore

improving filler utilization efficiency at a moderate filler fraction is important. In this work

topology optimization was used to guide the design of graphite filler structures in polydimethylsiloxane (PDMS) composites. Based on finite element simulations

a simple dumbbell-shaped graphite filler was proposed. This structure contained a continuous central heat-conduction path and expanded end regions

which could reduce through-plane thermal resistance and promote lateral heat spreading. Graphite/PDMS composites with cubic

cylindrical

frustum-like

and dumbbell-shaped fillers were fabricated by computer numerical control machining

followed by PDMS encapsulation and curing. Infrared thermal imaging and heat-flow-based tests were used

to evaluate their thermal responses. Compared with conventional cylindrical and cubic fillers

the dumbbell-shaped filler produced a more uniform temperature distribution and stronger hotspot suppression. Under vacuum conditions

the hot-cold side temperature difference was reduced by 8.6 and 5.4 ℃

respectively. The dumbbell-array composite showed a heat dissipation efficiency of 0.028 W·℃⁻

1.47 times that of the cylindrical-array composite. This work provides an effective strategy for designing conductive filler architectures in polymer-based thermal management composites.

关键词

Keywords

references

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