LIU Run-shan, HU Zheng-lun, XIA Jing, DENG Mei-wen. THE HEAT RESISTANT STRAIN GAGE ADHESIVES WITH LARGER RANGE OF PLASTIC STRAIN AND ITS THERMAL IMIDIZATION. [J]. Acta Polymerica Sinica (6):721-727(1989)
DOI:
LIU Run-shan, HU Zheng-lun, XIA Jing, DENG Mei-wen. THE HEAT RESISTANT STRAIN GAGE ADHESIVES WITH LARGER RANGE OF PLASTIC STRAIN AND ITS THERMAL IMIDIZATION. [J]. Acta Polymerica Sinica (6):721-727(1989)DOI:
THE HEAT RESISTANT STRAIN GAGE ADHESIVES WITH LARGER RANGE OF PLASTIC STRAIN AND ITS THERMAL IMIDIZATION
It has been found that the strain gage adhesives (SGA) with larger range of plastic strain. (e>8%) and sensitivity (k>1.85) can be used in the range of RT to 300℃.The thermal imidization of SCA had been studied in solid phase at RT to 300℃ by measuring their adhesion
solubility
creep properties and by TMA
TBA
TGA. and IR etc. The results showed that polymer was glassy (Tg>280℃) after rapid imidization of SGA at 125-155℃
and reaction was slow with the deeping of imidization. The maximun degree of imidization. The maximun degree of imi-dization and molecular weight were achieved at 225℃ in the flexible glass state of polymer. The imidization temperature is at 250-260℃ for obtaining optimun integrative properties of polymers.