您当前的位置:
首页 >
文章列表页 >
THE PREPARATION OF THE SILICONE RESIN FOR ENCAPSULATION OF ELECTRONIC DEVICES
Research Bulletin | 更新时间:2021-03-19
    • THE PREPARATION OF THE SILICONE RESIN FOR ENCAPSULATION OF ELECTRONIC DEVICES

    • Acta Polymerica Sinica   Issue 2, Pages: 124-125(1978)
    • Published:20 December 1966,

    扫 描 看 全 文

  • C. C. Li, Lin Sy-tsong, Ruey Min-jiuan, Lei Sheue-lian, Wang Dah-chyi, Yao Sue-fang, Bnu Moo-Ian, Shyu Ma-lin. THE PREPARATION OF THE SILICONE RESIN FOR ENCAPSULATION OF ELECTRONIC DEVICES. [J]. Acta Polymerica Sinica (2):124-125(1978) DOI:

  •  
  •  
更多指标>

0

Views

8

下载量

0

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

No data

Related Author

No data

Related Institution

No data
0