The dynamic spring analysis (DSA) has been improved by strengthening two ends of the spring. In this way the accuracy of measuring dynamic modulus was increased. The improved method can be applied not only to the rubbery state of polymers but also to their glassy state.The isothermal curing processes of the bisphenol A epoxy resin cured by 4

4'-diaminodiphenylmethane were measured by the improved DSA method. The apparent kinetic analysis of the curing processes has been made.