Curing behaviors and kinetic analysis of novel poly (phenothioxine-formaldehyde) (POSPF)resin were studied by means of IR
DSC and TG.It was shown that active hydroxymethyl groups changed into methylene in the curing process of resin by the use of hexamethylene-tetramine/α
α′-dichloro-m-xylene as curing agents. The exothermic peak on the DSC curve is wide and smooth because of lower activity of curing reaction.Initial temperature (Ti=100℃)
curing temperature(Tp=18l.5℃)and terminal temperature(Tf=225.7℃) were calculated by extrdpolating T-β.The cured resin has good heat-resistance.The temperature of 5% thermal weight loss reach up to 403℃.