A curing reaction model suitable for a novel liquid crystalline expoxy resin 4

4′-diglycidyl ether of azobisphenol/4

4′-diaminodiphenyl methane (DGEAP/DDM) system was established on the base of the principle of diffusion-controlled reactions. The reaction radius of the reactive group in DGEAP/DDM curing decreased with the increase of the extent of the reaction

which was the same as that in the curing of traditional epoxy resins. Because of the effect of orientation orders on the distribution of the reactive group

which was called the "pseudo-concentration effect"

the concentration of the reactive group in the ordered domain was higher than that in the siotropic domain. It was confirmed by the comparison of the DGEAP/DDM system with the ordinary epoxy resin system that the pseudo-concentration effect does exist and affect the diffusion-controlled reaction kinetics.