通过交联抑制高温下氢键的解离提高聚酰亚胺的耐热性和尺寸稳定性

罗龙波; 叶信合; 易江; 李科; 刘向阳

doi:10.11777/j.issn1000-3304.2020.20222

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通过交联抑制高温下氢键的解离提高聚酰亚胺的耐热性和尺寸稳定性

研究论文 | 更新时间：2021-03-05

- 通过交联抑制高温下氢键的解离提高聚酰亚胺的耐热性和尺寸稳定性
- Heat Resistance and Dimensional Stability of Polyimide Improved by Inhibiting the Dissociation of Hydrogen Bonds at High Temperatures through Crosslinking
- 高分子学报 2021年52卷第4期页码：363-370
- 作者机构：
  
  1.四川大学高分子科学与工程学院高分子材料工程国家重点实验室　成都 610065
  2.四川轻化工大学材料科学与工程学院　自贡 643002
- 作者简介：
  
  E-mail: lxy6912@sina.com
- 基金信息：
  
  国家自然科学基金(基金号 51873113，51803137)和四川大学-自贡市校地科技合作专项资金(项目号 2019CDZG-20)资助项目()
- DOI：10.11777/j.issn1000-3304.2020.20222
  中图分类号：
- 纸质出版日期：2021-4-3，
  
  网络出版日期：2020-12-9，
  
  收稿日期：2020-9-23，
  
  修回日期：2020-10-27，
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罗龙波, 叶信合, 易江, 李科, 刘向阳. 通过交联抑制高温下氢键的解离提高聚酰亚胺的耐热性和尺寸稳定性[J]. 高分子学报, 2021,52(4):363-370.

Long-bo Luo, Xin-he Ye, Jiang Yi, Ke Li, Xiang-yang Liu. Heat Resistance and Dimensional Stability of Polyimide Improved by Inhibiting the Dissociation of Hydrogen Bonds at High Temperatures through Crosslinking[J]. Acta Polymerica Sinica, 2021,52(4):363-370.
罗龙波, 叶信合, 易江, 李科, 刘向阳. 通过交联抑制高温下氢键的解离提高聚酰亚胺的耐热性和尺寸稳定性[J]. 高分子学报, 2021,52(4):363-370. DOI： 10.11777/j.issn1000-3304.2020.20222.

Long-bo Luo, Xin-he Ye, Jiang Yi, Ke Li, Xiang-yang Liu. Heat Resistance and Dimensional Stability of Polyimide Improved by Inhibiting the Dissociation of Hydrogen Bonds at High Temperatures through Crosslinking[J]. Acta Polymerica Sinica, 2021,52(4):363-370. DOI： 10.11777/j.issn1000-3304.2020.20222.

摘要

将炔基结构引入该聚酰亚胺主链中，通过热引发化学交联反应构建化学限域位点，抑制高温下氢键的减弱和解离，进而通过交联和高温下更加稳定的氢键协同性提升了该PI薄膜在高温下的尺寸稳定性. 结果表明，相对于线性PI，交联后PI在400 °C的强氢键含量达到26.1%，与未交联PI相比提高了近50%，从而将300~400 °C范围的的热膨胀系数(CTE)从33.8×10

−6

/K降低至5.1×10

−6

/K. 最终制备的PI膜的

高达452 °C，40~400 °C范围内的CTE仅为2.1×10

−6

/K，拉伸强度高达231 MPa，有望用于AMOLED的基底材料.

Abstract

Polyimide (PI) containing benzimidazole structure exhibits good heat resistance and dimensional stability due to the intermolecular hydrogen bonding

which is regarded as promising substrate material for OLED flexible display devices. However

the dissociation of hydrogen bonds at high temperatures results in PI film high thermal expansion coefficient in the temperature range above 300 °C

limiting the practicality of the PI film as the flexible display substrate material. In this study

the dianhydride containing alkynyl structure was introduced into the PI’s main chain

and chemically restricted sites were constructed by chemical crosslinking reactions to suppress the dissociation of hydrogen bonds at high temperatures

thereby improving the thermal performance of the PI film. The results show that

compared with linear polyimide

the hydrogen bonding content of PI at 400 °C is increased by nearly 50% after crosslinking. Correspondingly

the glass transition temperature of the chemically cross-linked PI film is as high as 452 °C

and the thermal expansion coefficient in the range of 40−400 °C is only 2.1×10

−6

/K. And the tensile strength of obtained PI film reaches 230.9 MPa. This PI film would be as potential substrate material for flexible display devices.

关键词

聚酰亚胺氢键相互作用化学交联尺寸稳定

Keywords

PolyimideHydrogen bondChemical crosslinkingDimensional stability

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