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Influence of 3D Printing Parameters on the Interlayer Bonding Strength for TPU Soft Materials
- Acta Polymerica Sinica Issue 4, Pages: 532-540(2018)
- 作者机构：
1.高分子合成与功能构造教育部重点实验室 杭州 310027
2.浙江大学高分子科学与工程学系 杭州 310027
3.浙江大学机械工程学院 杭州 310027
- 作者简介：
- 基金信息：
DOI：10.11777/j.issn1000-3304.2017.17146
CLC：Published：20 April 2018，
Received：1 June 2017，
扫 描 看 全 文
Yan-bo Zhu, Miao Du, Chao-hua Lu, Jun Yin, Qiang Zheng. Influence of 3D Printing Parameters on the Interlayer Bonding Strength for TPU Soft Materials. [J]. Acta Polymerica Sinica (4):532-540(2018)
Yan-bo Zhu, Miao Du, Chao-hua Lu, Jun Yin, Qiang Zheng. Influence of 3D Printing Parameters on the Interlayer Bonding Strength for TPU Soft Materials. [J]. Acta Polymerica Sinica (4):532-540(2018) DOI： 10.11777/j.issn1000-3304.2017.17146.
摘要
将热塑性聚氨酯弹性体（TPU）软材料通过挤出机制成线料，并用改进的基于熔融沉积原理（FDM）的3D打印机进行打印，考察了打印参数对打印物形貌及层间粘接强度的影响.研究发现，软硬段含量适宜的TPU弹性体软材料可用于FDM模式3D打印，打印层高对打印物的形貌影响较大，层高较大时，层间粘接面积小，打印物易发生变形；层高较小时，层间粘接面积大，打印物层与层之间出现挤压变形.同等条件下，TPU软材料3D打印物层间粘接强度为模压样品的70%左右，而硬质材料ABS的3D打印物层间粘接强度仅为模压样品的48%.研究还发现，层高设置及热台温度对打印物层间粘接强度影响较大，而打印速度和打印温度对样条层间粘接强度影响较小.采用TPU弹性体软材料打印的试样具有良好的回弹性，可弯折，试样外轮廓尺寸误差在1.65%以内.
Abstract
By using the improved 3D printer based on the fused deposition method (FDM)
thermoplastic polyurethane (TPU) elastomer soft materials were printed into stereoscopic objects. The conventional 3D printer in a FDM mode was improved for soft materials TPU. That is
the distance between the pulling wheels and heated nozzle was shortened and a polytetrafluoroethylene pipe was added to avoid the bending of the soft linear feedstock during 3D printing process. Influence of 3D printing parameter on the appearance and interlayer bonding strength of the printed products were explored. TPU with appropriate content of hard and soft segments could be used for 3D printing. In terms of printing parameter
the layer space has great influence on the appearance of the printed product. When the layer space is set too large
the bonding area will be smaller and the product prone to deform at the corner. If the layer space is set too small
the printing soft line will squeeze each other and cause the printed product deformation and the hollow structure is hard to put up. A novel model for tensile test was designed to characterize the interlayer bonding strength of the printed products. The models
which are divided into two parts during 3D printing process
are bonded to each other layer by layer. The interlayer bonding strength of the 3D printed products with TPU soft materials can catch 70% of that of the samples prepared by mould pressing
and only 48% for that of stiff printing materials. Both the layer space and platform temperature have significant impact on the interlayer bonding strength of the printed product. High platform temperature and low layer space could strengthen the interlayer bonding. The printing speed and printing temperature have little influence on the interlayer bonding strength. The outer contour error of the geometrical shape printed by TPU soft materials is within 1.65% only. Furthermore
the objects printed using TPU soft materials have great resilience and are also easy to bend.
关键词
3D打印熔融沉积法TPU软材料层间粘接强度
Keywords
3D PrintingFused deposition method (FDM)Thermoplastic polyurethane (TPU) soft materialsInterlayer bonding strength
references
Xiaoling Yang , Tianrui Zhou . J Zhejiang Inst Sci Technol , 2009 . 21 ( 3 ): 186 - 189 . http://doi.wanfangdata.com.cn/10.3969/j.issn.1671-8798.2009.03.007.
杨 小玲 , 周 天瑞 . 浙江科技学院学报 , 2009 . 21 ( 3 ): 186 - 189 . http://doi.wanfangdata.com.cn/10.3969/j.issn.1671-8798.2009.03.007.
Yanqing Wang , Jingxing Shen , Haiquan Wu . J Aeronaut Mater , 2016 . 36 ( 4 ): 89 - 98 . http://www.cqvip.com/QK/91216X/201604/669623990.html.
王 延庆 , 沈 竞兴 , 吴 海全 . 航空材料学报 , 2016 . 36 ( 4 ): 89 - 98 . http://www.cqvip.com/QK/91216X/201604/669623990.html.
G Mazzoleni , D Di Lorenzo , N Steimberg . Genes & Nutrition , 2009 . 4 ( 1 ): 13 - 22 . http://link.springer.com/article/10.1007/s12263-008-0107-0.
F Rengier , A Mehndiratta , H von Tengg-Kobligk , C M Zechmann , R Unterhinninghofen , H U Kauczor , F L Giesel . Int J Comput Ass Rad , 2010 . 5 ( 4 ): 335 - 341 . http://pubs.acs.org/doi/full/10.1021/acsami.7b02756.
Y Carter , T T Allard , N C Moore , A L Goertzen , T Klonisch , R D Hoppa . FASEB J , 2009 . 23 ( 1 ): 479 - 481.
Bingheng Lu , Dichen Li . Mech Manuf Automat , 2013 . 42 ( 4 ): 1 - 4 . http://www.cqvip.com/QK/93764X/201304/47187241.html.
卢 秉恒 , 李 涤尘 . 机械制造与自动化 , 2013 . 42 ( 4 ): 1 - 4 . http://www.cqvip.com/QK/93764X/201304/47187241.html.
Chaoliang He , zhaohui Tang , Huayu Tian , Xuesi Chen . Acta Polymerica Sinica , 2013 . ( 6 ): 722 - 732 . http://www.gfzxb.org/article/doi/10.3724/SP.J.1105.2013.12430.
贺 超良 , 汤 朝晖 , 田 华雨 , 陈 学思 . 高分子学报 , 2013 . ( 6 ): 722 - 732 . http://www.gfzxb.org/article/doi/10.3724/SP.J.1105.2013.12430.
J D Williams , C R Deckard . Rapid Prototyping J , 1998 . 4 ( 2 ): 90 - 100 . DOI:10.1108/13552549810210257http://doi.org/10.1108/13552549810210257.
M Vaezi , H Seitz , S Yang . Int J Adv Manuf Tech , 2013 . 67 1721 - 1754 . DOI:10.1007/s00170-012-4605-2http://doi.org/10.1007/s00170-012-4605-2.
E L Melgoza , G Vallicrosa , L Serenó , J Ciurana , C A Rodríguez . Rapid Prototyping J , 2014 . 20 ( 1 ): 2 - 12 . DOI:10.1108/RPJ-01-2012-0003http://doi.org/10.1108/RPJ-01-2012-0003.
I Zein , D W Hutmacher , K C Tan , S H Teoh . Biomaterials , 2002 . 23 ( 4 ): 1169 - 1185 . DOI:10.1016/S0142-9612(01)00232-0http://doi.org/10.1016/S0142-9612(01)00232-0.
G Marchioli , L Van Gurp , P P Van Krieken , D Stamatialis , M Engelse , C A van Blitterswijk , M B J Karperien , E Koning , J Alblas , L Moroni , A A van Apeldoorn . Biofabrication , 2015 . 7 ( 2 ): 025009 DOI:10.1088/1758-5090/7/2/025009http://doi.org/10.1088/1758-5090/7/2/025009.
B Duan , M Wang , W Y Zhou , W L Cheung , Z Y Li , W W Lu . Acta Biomaterialia , 2010 . 6 ( 12 ): 4495 - 4505 . DOI:10.1016/j.actbio.2010.06.024http://doi.org/10.1016/j.actbio.2010.06.024.
A Das , G Madras , N Dasgupta , A M Umarji . J Eur Ceram Soc , 2003 . 23 ( 7 ): 1013 - 1017 . DOI:10.1016/S0955-2219(02)00266-2http://doi.org/10.1016/S0955-2219(02)00266-2.
J Korpela , A Kokkari , H Korhonen , M Malin , T Närhi , J Seppälä . J Biomed Mater Res B , 2013 . 101 ( 4 ): 610 - 619 . http://europepmc.org/abstract/MED/23281260.
C R Rocha , A R T Perez , D A Roberson , C M Shemelya , E MacDonald , R B Wicker . J Mater Res , 2014 . 29 1859 - 1866 . DOI:10.1557/jmr.2014.158http://doi.org/10.1557/jmr.2014.158.
Juan Du , Hui Wang , Weiqiao Liu . Rubber Reference , 2012 . 42 ( 2 ): 27 - 29 . http://www.cqvip.com/QK/92659X/201202/41606885.html.
杜 娟 , 王 辉 , 刘 玮桥 . 橡胶参考资料 , 2012 . 42 ( 2 ): 27 - 29 . http://www.cqvip.com/QK/92659X/201202/41606885.html.
W Yu , M Du , D Zhang , Y Lin , Q Zheng . Macromolecules , 2013 . 46 7341 - 7351 . DOI:10.1021/ma401260dhttp://doi.org/10.1021/ma401260d.
Mengxue An . Polyurethane Elastomer Handbook , : Beijing Chemical Industry Press , 2001 . 136 - 144.
安 孟学 . 聚氨酯弹性体手册 , : 北京 化学工业出版社 , 2001 . 136 - 144.
O S Carneiro , A F Silva , R Gomes . Mater Design , 2015 . 83 768 - 776 . DOI:10.1016/j.matdes.2015.06.053http://doi.org/10.1016/j.matdes.2015.06.053.
Manjun He , Wiexiao Chen , Xixia Dong , Hongdong Zhang . Polymer Physics , : Shanghai Fudan University Press , 2007 . 242 - 244.
何 曼君 , 陈 维孝 , 董 西侠 , 张 红东 . 高分子物理 , : 上海 复旦大学出版社 , 2007 . 242 - 244.
Yihu Song , Miao Du , Hongmei Yang , Qiang Zheng . Acta Polymerica Sinica , 2013 . ( 9 ): 1115 - 1130 . http://www.gfzxb.org/article/doi/10.3724/SP.J.1105.2013.13135.
宋 义虎 , 杜 淼 , 杨 红梅 , 郑 强 . 高分子学报 , 2013 . ( 9 ): 1115 - 1130 . http://www.gfzxb.org/article/doi/10.3724/SP.J.1105.2013.13135.
J G Zhou , D Herscovici , C C Chen . Int J Mach Tool Manu , 2000 . 40 ( 3 ): 363 - 379 . DOI:10.1016/S0890-6955(99)00068-1http://doi.org/10.1016/S0890-6955(99)00068-1.
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