Study on the Construction of 3D-BN Network in Epoxy Resin by Introducing Foam Skeleton

Rong Yan; Ling Zhang; Chun-zhong Li

doi:10.11777/j.issn1000-3304.2019.19064

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Study on the Construction of 3D-BN Network in Epoxy Resin by Introducing Foam Skeleton

Research Article | 更新时间：2021-01-26

- Study on the Construction of 3D-BN Network in Epoxy Resin by Introducing Foam Skeleton
- Acta Polymerica Sinica Vol. 50, Issue 11, Pages: 1202-1210(2019)
- 作者机构：
  
  华东理工大学材料科学与工程学院超细材料制备与应用教育部重点实验室上海多级结构纳米材料工程技术研究中心　上海 200237
- 作者简介：
- 基金信息：
- DOI：10.11777/j.issn1000-3304.2019.19064
  CLC：
- Published：2019-11，
  
  Published Online：10 June 2019，
  
  Received：1 April 2019，
  
  Revised：25 April 2019，
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Rong Yan, Ling Zhang, Chun-zhong Li. Study on the Construction of 3D-BN Network in Epoxy Resin by Introducing Foam Skeleton. [J]. Acta Polymerica Sinica 50(11):1202-1210(2019)
DOI：

Rong Yan, Ling Zhang, Chun-zhong Li. Study on the Construction of 3D-BN Network in Epoxy Resin by Introducing Foam Skeleton. [J]. Acta Polymerica Sinica 50(11):1202-1210(2019) DOI： 10.11777/j.issn1000-3304.2019.19064.

摘要

基于在聚合物基体中添加导热物质，构筑致密导热网络可以改善基体的低导热性，引入泡沫作为骨架，利用其三维支架结构，结合2D片状无机填料氮化硼作为导热填料，在环氧树脂中构筑导热网络. 通过研究2种具有不同骨架结构和组成的泡沫：聚氨酯泡沫和纳米三聚氰胺(蜜胺)泡沫，采取先浸渍后热压固化的方法，获得具有高热导率的环氧树脂基复合材料. 最后，当氮化硼含量为41 wt%，热压固化时的压缩比为90%时，复合材料面穿方向热导率可高达3.88 W·m

–1

·K

–1

Abstract

It is a traditional method to improve the thermal conductivity of matrix by adding fillers. However

it is a great challenge to construct a dense heat conduction network in composite material. The current researches on building thermal conductive network is to combine different fillers through structure design for achieving high thermal conductivity with the lowest possible filler content. Due to the electrical insulation requirements of electronic equipment

hexagonal boron nitride (h-BN) has been extensively studied as an inorganic thermal conductive filler. It has a layer structure that shows a relatively high TC of 300 W·m

–1

·K

–1

in the h-BN planar direction. In this study

the foam was introduced into the epoxy resin as a skeleton

and thermal conductive network was constructed by immersing the BN/E51 mixture into the foam. By comparing the hot deformation behavior of two kinds of foams with different structures and compositions: polyurethane foam (PF) and nano-melamine (melamine) foam (MF)

epoxy resin-based composites with high thermal conductivity were obtained by hot press curing under the right compression ratio. PF has a large single arm size and good elastic deformation ability

but it is easy to become a barrier between BN

which is bad for forming thermal conductive path after compression. However

MF has a small single arm size and can be broken into four needle-like scaffold structures after compression. The needle-like scaffold structure promotes the good dispersion of BN

and finally forms a thermal path of BN throughout the material

which plays a key role in improving the thermal conductivity of the composite. As a result

MF-BN/E51 showed an excellent thermal conductivity of 3.88 W·m

–1

·K

–1

at 41 wt% BN load when the degree of hot pressing was 90%. It provides a new way for the composites to achieve a higher thermal conductivity with a less filler load.

关键词

聚氨酯泡沫蜜胺泡沫氮化硼导热网络热导率

Keywords

Polyurethane foamMelamine foamBoron nitrideThermal conductive networkThermal conductivity

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(Collaborative Innovation Center for Eco-Friendly and Fire-Safety Polymeric Materials (MoE), State Key Laboratory of Polymer Materials Engineering, National Engineering Laboratory of Eco-Friendly Polymeric Materials (Sichuan), College of Chemistry, Sichuan University, )

School of Chemistry, Key Laboratory of Bio-Inspired Smart Interfacial Science and Technology of Ministry of Education, Beihang University

College of Materials Science and Engineering, Qingdao University of Science and Technology

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