Heat Resistance and Dimensional Stability of Polyimide Improved by Inhibiting the Dissociation of Hydrogen Bonds at High Temperatures through Crosslinking

Long-bo Luo; Xin-he Ye; Jiang Yi; Ke Li; Xiang-yang Liu

doi:10.11777/j.issn1000-3304.2020.20222

您当前的位置：

首页 >

文章列表页 >

Heat Resistance and Dimensional Stability of Polyimide Improved by Inhibiting the Dissociation of Hydrogen Bonds at High Temperatures through Crosslinking

Research Article | 更新时间：2021-03-05

- Heat Resistance and Dimensional Stability of Polyimide Improved by Inhibiting the Dissociation of Hydrogen Bonds at High Temperatures through Crosslinking
- Acta Polymerica Sinica Vol. 52, Issue 4, Pages: 363-370(2021)
- 作者机构：
  
  1.四川大学高分子科学与工程学院高分子材料工程国家重点实验室　成都 610065
  2.四川轻化工大学材料科学与工程学院　自贡 643002
- 作者简介：
- 基金信息：
- DOI：10.11777/j.issn1000-3304.2020.20222
  CLC：
- Published：3 April 2021，
  
  Published Online：9 December 2020，
  
  Received：23 September 2020，
  
  Revised：27 October 2020，
扫描看全文
Long-bo Luo, Xin-he Ye, Jiang Yi, Ke Li, Xiang-yang Liu. Heat Resistance and Dimensional Stability of Polyimide Improved by Inhibiting the Dissociation of Hydrogen Bonds at High Temperatures through Crosslinking. [J]. Acta Polymerica Sinica 52(4):363-370(2021)
DOI：

Long-bo Luo, Xin-he Ye, Jiang Yi, Ke Li, Xiang-yang Liu. Heat Resistance and Dimensional Stability of Polyimide Improved by Inhibiting the Dissociation of Hydrogen Bonds at High Temperatures through Crosslinking. [J]. Acta Polymerica Sinica 52(4):363-370(2021) DOI： 10.11777/j.issn1000-3304.2020.20222.

摘要

将炔基结构引入该聚酰亚胺主链中，通过热引发化学交联反应构建化学限域位点，抑制高温下氢键的减弱和解离，进而通过交联和高温下更加稳定的氢键协同性提升了该PI薄膜在高温下的尺寸稳定性. 结果表明，相对于线性PI，交联后PI在400 °C的强氢键含量达到26.1%，与未交联PI相比提高了近50%，从而将300~400 °C范围的的热膨胀系数(CTE)从33.8×10

−6

/K降低至5.1×10

−6

/K. 最终制备的PI膜的

高达452 °C，40~400 °C范围内的CTE仅为2.1×10

−6

/K，拉伸强度高达231 MPa，有望用于AMOLED的基底材料.

Abstract

Polyimide (PI) containing benzimidazole structure exhibits good heat resistance and dimensional stability due to the intermolecular hydrogen bonding

which is regarded as promising substrate material for OLED flexible display devices. However

the dissociation of hydrogen bonds at high temperatures results in PI film high thermal expansion coefficient in the temperature range above 300 °C

limiting the practicality of the PI film as the flexible display substrate material. In this study

the dianhydride containing alkynyl structure was introduced into the PI’s main chain

and chemically restricted sites were constructed by chemical crosslinking reactions to suppress the dissociation of hydrogen bonds at high temperatures

thereby improving the thermal performance of the PI film. The results show that

compared with linear polyimide

the hydrogen bonding content of PI at 400 °C is increased by nearly 50% after crosslinking. Correspondingly

the glass transition temperature of the chemically cross-linked PI film is as high as 452 °C

and the thermal expansion coefficient in the range of 40−400 °C is only 2.1×10

−6

/K. And the tensile strength of obtained PI film reaches 230.9 MPa. This PI film would be as potential substrate material for flexible display devices.

关键词

聚酰亚胺氢键相互作用化学交联尺寸稳定

Keywords

PolyimideHydrogen bondChemical crosslinkingDimensional stability

references

Bai Lan(白兰), Zhai Lei(翟磊), He Minhui(何民辉), Wang Changou(王畅鸥), Mo Song(莫松), Fan Lin(范琳) . Acta Polymerica Sinica(高分子学报) , 2019 . 50 ( 12 ): 1305 - 1313 . DOI:10.11777/j.issn1000-3304.2019.19099http://doi.org/10.11777/j.issn1000-3304.2019.19099 .

Xu Zhiping(许志平). Study on Flexible Polyimide Substrate for Active Matrix Organic Light Emitting Diodes Display (用于AMOLED显示的聚酰亚胺柔性衬底研究). Doctoral Dissertation of South China University of Technology(华南理工大学博士论文), 2017

Bai L, Zhai L, He M H, Wang C O, Mo S, Fan L . Chinese J Polym Sci , 2020 . 38 ( 7 ): 748 - 758 . DOI:10.1007/s10118-020-2366-1http://doi.org/10.1007/s10118-020-2366-1 .

Wang Z H, Chen X, Yang H X, Zhao J, Yang S Y . Chinese J Polym Sci , 2019 . 37 ( 3 ): 268 - 278 . DOI:10.1007/s10118-019-2173-8http://doi.org/10.1007/s10118-019-2173-8 .

Wang S, Zhou H, Dang G, Chen C . J Polym Sci, Part A: Polym Chem , 2009 . 47 ( 8 ): 2024 - 2031 . DOI:10.1002/pola.23306http://doi.org/10.1002/pola.23306 .

Sun M, Chang J, Tian G, Niu H, Wu D . J Mater Sci , 2016 . 51 ( 6 ): 2830 - 2840.

Luo L, Zhang J, Huang J, Feng Y, Peng C, Wang X, Liu X . J Appl Polym Sci , 2016 . 133 ( 39 ): 44000 DOI:10.1002/app.44000http://doi.org/10.1002/app.44000 .

Yue Z, Cai Y B, Xu S . J Polym Res , 2014 . 21 ( 6 ): 463 - 470 . DOI:10.1007/s10965-014-0463-yhttp://doi.org/10.1007/s10965-014-0463-y .

Lian M, Lu X, Lu Q . Macromolecules , 2018 . 51 ( 24 ): 10127 - 10135 . DOI:10.1021/acs.macromol.8b02282http://doi.org/10.1021/acs.macromol.8b02282 .

Tian Y Y, Luo L B, Yang Q Q, Zhang L J, Wang M, Wu D F, Wang X, Liu X Y . Polymer , 2020 . 188 122100 DOI:10.1016/j.polymer.2019.122100http://doi.org/10.1016/j.polymer.2019.122100 .

Skrovanek D J, Howe S E, Painter P C, Coleman M M . Macromolecules , 1985 . 18 ( 9 ): 1676 - 1683 . DOI:10.1021/ma00151a006http://doi.org/10.1021/ma00151a006 .

Skrovanek D J, Painter P C, Coleman M M . Macromolecules , 1986 . 19 ( 3 ): 699 - 705 . DOI:10.1021/ma00157a037http://doi.org/10.1021/ma00157a037 .

Fang X, Hutcheon R, Scola D A . J Polym Sci, Part A: Polym Chem , 2000 . 38 ( 14 ): 2526 - 2535 . DOI:10.1002/1099-0518(20000715)38:14<2526::AID-POLA20>3.0.CO;2-2http://doi.org/10.1002/1099-0518(20000715)38:14<2526::AID-POLA20>3.0.CO;2-2 .

Ando S, Harada M, Okada T, Ishige R . Polymers , 2018 . 10 ( 7 ): 761 - 774 . DOI:10.3390/polym10070761http://doi.org/10.3390/polym10070761 .

Dai Y, Feng J, Meng C, Luo L, Liu X . ChemistrySelect , 2019 . 4 ( 13 ): 3980 - 3983 . DOI:10.1002/slct.201900463http://doi.org/10.1002/slct.201900463 .

Ebisawa S, Ishii J, Sato M, Vladimirov L, Hasegawa M . Eur Polym J , 2010 . 46 ( 2 ): 283 - 297 . DOI:10.1016/j.eurpolymj.2009.10.015http://doi.org/10.1016/j.eurpolymj.2009.10.015 .

Ishii J, Shimizu N, Ishihara N, Ikeda Y, Sensui N, Matano T, Hasegawa M . Eur Polym J , 2010 . 46 ( 1 ): 69 - 80 . DOI:10.1016/j.eurpolymj.2009.09.002http://doi.org/10.1016/j.eurpolymj.2009.09.002 .

Ishii J, Takata A, Oami Y, Yokota R, Vladimirov L, Hasegawa M . Eur Polym J , 2010 . 46 ( 4 ): 681 - 693 . DOI:10.1016/j.eurpolymj.2010.01.007http://doi.org/10.1016/j.eurpolymj.2010.01.007 .

Rehman S, Song G, Jia H, Zhou H, Zhao X, Dang G, Chen C . J Appl Polym Sci , 2013 . 129 ( 5 ): 2561 - 2570 . DOI:10.1002/app.38969http://doi.org/10.1002/app.38969 .

Luo L B, Yao J, Wang X, Li K, Huang J Y, Li B Y, Wang H N, Feng Y, Liu X Y . Polymer , 2014 . 55 ( 16 ): 4258 - 4269 . DOI:10.1016/j.polymer.2014.06.080http://doi.org/10.1016/j.polymer.2014.06.080 .

更多指标>

Views

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Preparation and Properties of Composite Proton Exchange Membranes from Tröger's Base-based Polyimides/Polybenzimidazoles for Fuel Cells Operating in a Wide Temperature Range

Preparation and Performance of Thermally Rearranged Gas Separation Membranes Containing Tetraarylimidazole Structure

Preparation, Processing and Thermal Properties of Naphthaleneethynyl-terminated Silica-containing Polyimides

Preparation of Colorless Transparent Polyimide Films with High Comprehensive Properties

Preparation and Properties of Colorless Transparent Polyimide Films Based on Rigid Alicyclic Tetracarboxylic Anhydride

Related Author

No data

Related Institution

School of Chemical Engineering, University of Chinese Academy of Sciences

State Key Laboratory of Biochemical Engineering, Institute of Process Engineering, Chinese Academy of Sciences

Chemistry and Environmental Engineering, Yangtze University

Carbon Research Laboratory, State Key Laboratory of Fine Chemicals, School of Chemical Engineering, Dalian University of Technology

School of Chemical Engineering, University of Science and Technology Liaoning

Postal code：100190
Tel：010-62588927 Email：gfzxb@iccas.ac.cn
Technical support is provided by Beijing Founder electronics co., LTD 京ICP备05002797号-8 京公网安备11010802024621
It is recommended to read the content of this site in Chrome&IE9+. Please switch to extreme mode in browser 360.
Cookies We use cookies to help provide and enhance our service and tailor content. By continuing, you agree to the use of cookies.

⁰