EPOXY RESIN CURING REACTION STUDIED BY DYNAMIC AND ISOTHERMAL MODEL FREE KINETICS

GAN Li; SUN Zhijie; GU Yizhuo; LI Min; ZHANG Zuoguang

doi:10.3724/SP.J.1105.2010.09319

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EPOXY RESIN CURING REACTION STUDIED BY DYNAMIC AND ISOTHERMAL MODEL FREE KINETICS

Research Article | 更新时间：2021-03-19

- EPOXY RESIN CURING REACTION STUDIED BY DYNAMIC AND ISOTHERMAL MODEL FREE KINETICS
- Acta Polymerica Sinica Issue 8, Pages: 1016-1022(2010)
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- DOI：10.3724/SP.J.1105.2010.09319
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- Published：20 August 2010，
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GAN Li, SUN Zhijie, GU Yizhuo, LI Min, ZHANG Zuoguang. EPOXY RESIN CURING REACTION STUDIED BY DYNAMIC AND ISOTHERMAL MODEL FREE KINETICS. [J]. Acta Polymerica Sinica (8):1016-1022(2010)
DOI：

GAN Li, SUN Zhijie, GU Yizhuo, LI Min, ZHANG Zuoguang. EPOXY RESIN CURING REACTION STUDIED BY DYNAMIC AND ISOTHERMAL MODEL FREE KINETICS. [J]. Acta Polymerica Sinica (8):1016-1022(2010) DOI： 10.3724/SP.J.1105.2010.09319.

摘要

基于DSC数据，采用以Vyazovkin积分法为基础的升温法非模型动力学和等温法非模型动力学对双酚A型环氧树脂E51/4，4′-二氨基二苯基砜（DDS）体系及多官能度环氧树脂AG80/DDS体系的固化过程进行了研究，并结合玻璃化转变温度的变化和原位红外测试技术，对比分析了升温与等温条件下的固化反应规律.结果表明，与传统的模型拟合法相比，非模型动力学更适合定量预测树脂固化反应过程，并能为固化过程中反应机理变化的研究提供重要依据；等温法非模型动力学能够更好地预测两种树脂体系在不同恒温条件下的固化反应历程，并且升温法与等温法非模型动力学所得到的反应活化能-固化度之间的变化关系不同，表明不同温度条件下树脂的反应机理不同，这与升温和恒温条件下玻璃化效应及环氧官能团的变化规律相吻合.

Abstract

The curing processes of bisphenol A epoxy resin E51/4

4′-diaminodiphenyl sulfone (DDS) and multi-functional epoxy resin AG80/DDS were studied using dynamic and isothermal model free kinetics (MFK) of Vyazovkin integral method based on DSC measurements.The MFK method from dynamic DSC data and the advanced MFK (AMFK) from isothermal DSC data were adopted to predict the evolution of curing degree and the relationship between activation energy and curing degree.Moreover

the curing reactions under dynamic and isothermal conditions were compared by the change of glass transition temperature and the experimental results of in situ infrared measuring method.The results show that comparing to traditional fitting model method

MFK is more suitable to predict quantitatively the curing process of epoxy resin and can provide important evidences for the study on the change of curing mechanism during curing reaction.Moreover

AMFK based on isothermal condition can predict the isothermal curing courses of two resin systems with higher accuracy.The relationships between reaction activation energy and the extent of cure obtained from dynamic and isothermal MFK are different

demonstrating that the curing mechanisms of two epoxy systems under different temperature conditions distinct.These results agree well with the vitrification effect and the evolution of epoxy group conversion under dynamic and isothermal conditions.

关键词

环氧树脂固化反应非模型动力学反应活化能DSC

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