Carbon black (CB)-filled polyimide (PI) composites were prepared using self-degradated low molecular poly(amic acid) (PAA) as impurity-free dispersant.CB and PAA/N-methyl-2-pyrrolidone (NMP) solution were milled in ball miller.The impurity-free dispersant was prepared in the process of in situ degradation of PAA by high-energy milling process
which was active to carbon black (CB) surface.The effect of PAA modification on the CB particles was researched by Raman
IR and UV-Vis.TEM observation showed that the PAA modified CB particles dispersed uniformly in the mixtures with an average CB size of about 200 nm.The toughness
tensile strength and the reproducibility of resistivity for resulted CB/PI composite films were greatly improved.The elongation of resulted CB/PI films was raised at least 50%
and sample-to-sample variation of elongation was decreased from 17% to 11%.The tensile strength variation range was reduced from 12 MPa to 5 MPa.Resistivity variation range was decreased from two orders down to an order.The molecular weight of PAA added in milling progress played an important role on the dispersion of CB.The dispersion uniformity of CB in PI matrix was greatly improved as the increase of PAA molecular weight.
Effect of Processing Technology on the Electrical Conductivity of Polymer Blends Filled with Carbon Black
PREPARATION OF NATURAL RUBBER COMPOSITES BY HIGH PRESSURE JET TECHNOLOGY
THE EFFECTS OF NANOCRYSTALLINE CELLULOSE IN THE MECHANICAL AND DYNAMIC PROPERTIES OF NATURAL RUBBER REINFORCED BY CARBON BLACK
EFFECT OF GLASS FIBER ON THE PROPERTIES OF ELECTRICALLY CONDUCTIVE POLYOXYMETHYLENE COMPOSITES
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Ministry of Education Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Zhejiang University
Key Laboratory of Pressure Systems and Safety, Ministry of Education, East China University of Science and Technology
College of Materials Science and Engineering,South China University of Technology
Key Laboratory of Advanced Materials MOE, Department of Chemical Engineering, Tsinghua University
Department of Material Science and Engineering, School of Material and Mechanical Engineering, Beijing Technology and Business University, Beijing 100048