Study on Low-polarity and Bulky Bismaleimide-Triazine Resin with Hierarchical Curing and Its Glass Fiber Reinforced Copper Clad Laminates

Lin-yan Zhu; Wen-guang Zhang; Li-shuai Zong; Jin-yan Wang; Xi-gao Jian

doi:10.11777/j.issn1000-3304.2026.26104

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Study on Low-polarity and Bulky Bismaleimide-Triazine Resin with Hierarchical Curing and Its Glass Fiber Reinforced Copper Clad Laminates

Research Article | 更新时间：2026-07-30

- Study on Low-polarity and Bulky Bismaleimide-Triazine Resin with Hierarchical Curing and Its Glass Fiber Reinforced Copper Clad Laminates
- Acta Polymerica Sinica Vol. 57, Issue 8, Pages: 1786-1797(2026)
- 作者机构：
  
  1.大连理工大学化工学院高分子材料系大连 116024
  2.大连理工大学化工学院先进高分子及复合材料教育部工程研究中心大连 116024
- 作者简介：
  
  Li-shuai Zong, E-mail: zongls@dlut.edu.cn
  Xi-gao Jian, E-mail: jian4616@dlut.edu.cn
- 基金信息：
- DOI：10.11777/j.issn1000-3304.2026.26104
  CLC：
- CSTR：32057.14.GFZXB.2026.7623
- Received：03 April 2026，
  
  Accepted：13 May 2026，
  
  Online First：10 July 2026，
  
  Published：20 August 2026
- 稿件说明：
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朱琳艳, 张文广, 宗立率, 王锦艳, 蹇锡高. 分级固化低极性大体积马来酰亚胺-三嗪树脂及其玻璃纤维覆铜板的研究. 高分子学报, 2026, 57(8), 1786-1797.

Zhu, L. Y.; Zhang, W. G.; Zong, L. S.; Wang, J. Y.; Jian, X. G. Study on low-polarity and bulky bismaleimide-triazine resin with hierarchical curing and its glass fiber reinforced copper clad laminates. Acta Polymerica Sinica (in Chinese), 2026, 57(8), 1786-1797.
朱琳艳, 张文广, 宗立率, 王锦艳, 蹇锡高. 分级固化低极性大体积马来酰亚胺-三嗪树脂及其玻璃纤维覆铜板的研究. 高分子学报, 2026, 57(8), 1786-1797. DOI： 10.11777/j.issn1000-3304.2026.26104. CSTR： 32057.14.GFZXB.2026.7623.

Zhu, L. Y.; Zhang, W. G.; Zong, L. S.; Wang, J. Y.; Jian, X. G. Study on low-polarity and bulky bismaleimide-triazine resin with hierarchical curing and its glass fiber reinforced copper clad laminates. Acta Polymerica Sinica (in Chinese), 2026, 57(8), 1786-1797. DOI： 10.11777/j.issn1000-3304.2026.26104. CSTR： 32057.14.GFZXB.2026.7623.

摘要

通过调控含三苯基均三嗪结构的双马来酰亚胺(PT-BMI)与多胺型马来酰亚胺(BMI950)2种不同结构马来酰亚胺的比例，与双环戊二烯型氰酸酯(DCPDCE)，在双叔丁基过氧异丙基苯(BIPB)的引发下，分级固化得到低极性大体积马来酰亚胺-三嗪(BPT-Bs)树脂体系. 研究表明，分级固化依次发生马来酰亚胺自由基自聚、氰酸酯与马来酰亚胺共聚以及氰酸酯自聚反应. PT-BMI与BMI950复配的BPT-Bs体系加工窗口拓展至89 ℃，黏度低至90 mPa·s，树脂失重5%温度超过398 ℃，具有较高的热稳定性. BPT-Bs树脂基经玻璃纤维布增强制成了覆铜板，该复合材料具有优异的综合性能：玻璃化转变温度超过280 ℃，

轴与

轴热膨胀系数最低为13.5和6.1 ppm·K

-1

，介电常数为3.74~4.08，介电损耗为0.0058~0.0090，弯曲强度高于521 MPa，弯曲模量超过31.1

GPa，覆铜板的剥离强度为0.57~0.76 N·mm

-1

. 该分级固化策略通过引入低极性大体积刚性共轭结构与致密互穿网络，平衡了树脂的加工性、耐热性、尺寸稳定性与高频介电性能，为高频IC基板用高性能覆铜板基材提供了新思路.

Abstract

In this work

by adjusting the ratio of two maleimides with different structures

namely triphenyl-

-triazine-containing bismaleimide (PT-BMI) and polyamine-type maleimide (BMI950)

a series of bulky low-polarity maleimide-triazine (BPT-Bs) resin systems were fabricated

via

stepwise curing with dicyclopentadiene-type cyanate ester (DCPDCE) initiated by di-

tert

-butylperoxyisopropylbenzene (BIPB). The results revealed that the stepwise curing process sequentially underwwent radical self-polymerization of maleimide

copolymerization between cyanate ester and maleimide

and self-polymerization of cyanate ester. For the BPT-Bs systems modified with combined PT-BMI and BMI950

the processing window was broadened to 89 ℃ with a minimum viscosity as low as 90 mPa·s. The 5% weight loss temperature exceeded 398 ℃

demonstrating excellent thermal stability. Copper-clad laminates (CCLs) wer

e fabricated using glass fiber cloth-reinforced BPT-Bs resin composites. The as-prepared composites exhibited outstanding comprehensive performances: the glass transition temperature was higher than 280 ℃; the minimum coefficient of thermal expansion (CTE) along the

-axis and

-axis reached 13.5 and 6.1 ppm·K

-1

respectively; the dielectric constant ranged from 3.74 to 4.08

and the dielectric loss was in the range of 0.0058-0.0090. Moreover

the flexural strength was above 521 MPa

the flexural modulus exceeded 31.1 GPa

and the peeling strength of CCLs was between 0.57 and 0.76 N·mm

-1

.Through the construction of bulky low-polarity rigid conjugated structures and dense interpenetrating networks

this stepwise curing strategy effectively balanced the processability

heat resistance

dimensional stability and high-frequency dielectric properties of the resin. It provides a novel insight for the development of high-performance substrate materials of copper-clad laminates applied in high-frequency IC substrates.

关键词

Keywords

references

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Related Author

Lin-yan Zhu

Wen-guang Zhang

Li-shuai Zong

Jin-yan Wang

Xi-gao Jian

Related Institution

Department of Polymer Materials, School of Chemical Engineering, Ministry of Education, Dalian University of Technology

Engineering Research Center of Advanced Polymers and Composite Materials, Ministry of Education, Dalian University of Technology

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