Inflences of temperature and composition on the curing mechanism and the glass transition temperature (Tg) of the cured compound in benzyldimethylamine (BDMA) catalyzed-dicyan-diamide (DICY)-epoxy resins (DGEBA) system was studied by IR

DSC

dielectric and dynamic mechanical properties. The results indicated that the curing involved the addition reaction of amino groups with epoxy groups

besides the etherification of epoxy groups. The etherifica-tion as a competitive reaction was not favor both at 100℃ and 170℃.In addition

at 140℃ or 170℃

the reaction of cyano groups with hydroxy groups aor epoxy groups gave rise to im-ino-ether bond

which then rearranged to the compound of acylamide bond. A higher Tg of cu-red compound network could be reached with a amine-to-epoxy ratio(a/e) of 0.6 in the same cured condition.