柔性OLED显示用聚酰亚胺基板的合成与性能

杨正慧; 康传清; 郭海泉; 高连勋

doi:10.11777/j.issn1000-3304.2021.21077

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柔性OLED显示用聚酰亚胺基板的合成与性能

研究论文 | 更新时间：2023-12-20

- 柔性OLED显示用聚酰亚胺基板的合成与性能
- Synthesis and Properties of Polyimide Films for Flexible OLED Displays
- 高分子学报 2021年52卷第10期页码：1308-1315
- 作者机构：
  
  1.中国科学院长春应用化学研究所长春 130022
  2.中国科学技术大学应用化学与工程学院合肥 230026
- 作者简介：
  
  E-mail: hqguo@ciac.ac.cn
- 基金信息：
  
  国家重点研发计划(2017YFB0404700)
- DOI：10.11777/j.issn1000-3304.2021.21077
  中图分类号：
- 纸质出版日期：2021-10-20，
  
  网络出版日期：2021-08-20，
  
  收稿日期：2021-03-12，
  
  修回日期：2021-04-21，
扫描看全文
杨正慧,康传清,郭海泉等.柔性OLED显示用聚酰亚胺基板的合成与性能[J].高分子学报,2021,52(10):1308-1315.

Yang Zheng-hui,Kang Chuan-qing,Guo Hai-quan,et al.Synthesis and Properties of Polyimide Films for Flexible OLED Displays[J].ACTA POLYMERICA SINICA,2021,52(10):1308-1315.
杨正慧,康传清,郭海泉等.柔性OLED显示用聚酰亚胺基板的合成与性能[J].高分子学报,2021,52(10):1308-1315. DOI： 10.11777/j.issn1000-3304.2021.21077.

Yang Zheng-hui,Kang Chuan-qing,Guo Hai-quan,et al.Synthesis and Properties of Polyimide Films for Flexible OLED Displays[J].ACTA POLYMERICA SINICA,2021,52(10):1308-1315. DOI： 10.11777/j.issn1000-3304.2021.21077.

摘要

合成了一种含吡啶结构的刚性二胺，2-(4-氨基苯基)-5-氨基吡啶(PD)，将其与二氨基二苯醚(ODA)以及均苯四甲酸二酐(PMDA)共聚，调控分子链中刚性与柔性结构单元的比例，制备出一系列聚酰亚胺共聚物. 结果表明：随着聚酰亚胺中含吡啶结构的刚性二胺PD含量增加，玻璃化转变温度显著提高(

450 ℃)，热膨胀系数逐渐降低(CTE

5×10

-6

-1

，50~400 ℃). 同时，聚酰亚胺薄膜的拉伸强度提高(1.25倍)，模量显著增加(4.53倍)，但仍保持较高的断裂伸长率(

35%). 利用广角X射线衍射(WAXD)分析聚合物聚集态结构表明，含吡啶结构刚性二胺(PD)的引入使聚酰亚胺分子链倾向于有序排列和紧密堆积，结晶度增加. 因此，通过调控聚合物链中刚性二胺(PD)含量可使PI薄膜同时达到优异的尺寸稳定性、高耐热性、高强度以及较好的柔韧性，此类PI有望应用于柔性OLED显示领域.

Abstract

For the development of flexible OLED displays

the flexibility depends on the polymer substrate. In this work

the rigid-rod diamine (2-(4-aminophenyl-5-aminopyridine

PD) containing phenylpyridine was synthesized and copolymerized with diaminodiphenyl ether (ODA) and pyromellitic anhydride (PMDA) to form a range of polyimides with both rigid and flexible segments. The results show that the glass transition temperatures obviously increased (

450 ℃) and the thermal expansion coefficient gradually decreased (CTE

5×10

-6

-1

50~400 ℃) with the PD content increase in the polyimides. Furthermore

the tensile strength and modulus of the polyimide films increased by 1.25 times and 4.53 times

respectively

however

the polyimide films still have a high elongation at break of close to 40%. WAXD showed that the introduction of the rigid diamine (PD) in polyimide chains was conducive to orderly arrangement and compact packing

and as a result

the crystallinity increased. Therefore

the performances of the polyimide films could be systematically tailored by means of adjusting the main-chain rigidity

as well as the close packing and orientation of polymer chains by the formation of the intermolecular hydrogen bonds between poly(amic acid)s containing phenylpyridine. The PI films can simultaneously achieve excellent thermal dimensional stability

high heat resistance

high strength and high toughness

which is expected to be applied in the field of flexible OLED display.

关键词

聚酰亚胺柔性显示低热膨胀系数超高耐热

Keywords

PolyimidesFlexible OLEDLow thermal expansion coefficientSuperheat-resistant

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