基于图案化方法制备高导热氮化硼/液晶环氧复合材料

李俊伟; 张泽平; 容敏智; 章明秋

doi:10.11777/j.issn1000-3304.2024.24217

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基于图案化方法制备高导热氮化硼/液晶环氧复合材料

研究论文 | 更新时间：2025-01-24

- 基于图案化方法制备高导热氮化硼/液晶环氧复合材料
- Preparation of Boron Nitride/Liquid Crystal Epoxy Composites with High Thermal Conductivity Based on Patterning Method
- 高分子学报 2025年56卷第2期页码：306-321
- 作者机构：
  
  中山大学化学学院聚合物复合材料及功能材料教育部重点实验室广州 510275
- 作者简介：
- 基金信息：
  
  国家自然科学基金(基金号 ┣52033011);52373095┫;广东省重点领域研发计划(2020B010179001)
- DOI：10.11777/j.issn1000-3304.2024.24217
  中图分类号：
- CSTR：32057.14.GFZXB.2024.7309
- 纸质出版日期：2025-02-20，
  
  网络出版日期：2024-12-12，
  
  收稿日期：2024-08-22，
  
  录用日期：2024-10-17
- 稿件说明：
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李俊伟, 张泽平, 容敏智, 章明秋. 基于图案化方法制备高导热氮化硼/液晶环氧复合材料[J]. 高分子学报, 2025,56(2):306-321.

JUN-WEI LI, ZE-PING ZHANG, MIN-ZHI RONG, MING-QIU ZHANG. Preparation of Boron Nitride/Liquid Crystal Epoxy Composites with High Thermal Conductivity Based on Patterning Method. [J]. Acta polymerica sinica, 2025, 56(2): 306-321.
李俊伟, 张泽平, 容敏智, 章明秋. 基于图案化方法制备高导热氮化硼/液晶环氧复合材料[J]. 高分子学报, 2025,56(2):306-321. DOI： 10.11777/j.issn1000-3304.2024.24217. CSTR： 32057.14.GFZXB.2024.7309.

JUN-WEI LI, ZE-PING ZHANG, MIN-ZHI RONG, MING-QIU ZHANG. Preparation of Boron Nitride/Liquid Crystal Epoxy Composites with High Thermal Conductivity Based on Patterning Method. [J]. Acta polymerica sinica, 2025, 56(2): 306-321. DOI： 10.11777/j.issn1000-3304.2024.24217. CSTR： 32057.14.GFZXB.2024.7309.

摘要

环氧树脂作为传统覆铜板的绝缘基板，其导热性能相对较差，无法满足日益增长的散热需求. 本工作采用两步丝网印刷方法制备了具有高导热性能的图案化氮化硼/液晶环氧复合材料. 首先，以低氮化硼含量(10 wt%~30 wt%)的液晶环氧涂膜液作为基体印刷非图案区域，再以高氮化硼含量(60 wt%~80 wt%)的液晶环氧涂膜液填充图案化区域(点、线和网格)，通过图案点阵与基体中氮化硼的相互协同构建良好的面外和面内导热通路，获得了一系列高导热氮化硼/液晶环氧图案化复合材料，并深入探讨了图案化参数对材料性能的影响. 结果表明，丝网印刷的图案化复合材料在26.36 wt%氮化硼填料含量下实现了11.5和20.5 W/(m·K)的面外和面内热导率. 同时，在41.52 wt%氮化硼填料含量下的面外和面内热导率甚至可以达到26.0 W/(m·K)和36.6 W/(m·K)，分别是相同氮化硼含量的氮化硼/液晶环氧共混复合材料的10.8倍和11.8倍.

Abstract

Epoxy resin

traditionally used as the insulating substrate in copper clad laminates

exhibits relatively low thermal conductivity

which has emerged as a critical factor impeding effective heat dissipation. In this work

a two-step silk print approach was employed to fabricate hexagonal boron nitride (h-BN)/liquid crystal epoxy resin (LCER) composites with high thermal conductivity. Firstly

the non-patterned matrix was printed using a coating solution composed of LCER and lower content of (3-aminopropyl)triethoxysilane-modified h-BN sheets (h-BN@KH550

10 wt%-30 wt%)

followed by the filling of patterned regions (dots

lines and grids) with a LCER coating solution containing high content of h-BN@KH550 (60 wt%-80 wt%). By making use of the synergistic interactions among the h-BN@KH550 within patterned array and matrix

efficient through-plane and in-plane heat conduction pathways were successfully constructed. In addition

the influence of patterning parameters on material properties was explored. The resultant h-BN@KH550/LCER patterned composites containing 26.36 wt% h-BN@KH550 exhibited through-plane and in-plane thermal conductivities of 11.5 and 20.5 W/(m·K)

respectively. Furthermore

the through-plane and in-plane thermal conductivities can even reach 26.0 and 36.6 W/(m·K) at a h-BN@KH550 content of 41.52 wt%

which are 10.8 and 11.8 times those of boron nitride/LCER blend composites with identical weight ratio of h-BN@KH550 sheets.

关键词

导热复合材料液晶环氧图案化氮化硼

Keywords

Thermally conductive compositesLiquid crystal epoxyPatterningBoron nitride

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