基于Diels-Alder键的可注塑、可回收、高填充Al<sub>2</sub>O<sub>3</sub>/不饱和聚酯导热复合材料

曹园; 莫伟杰; 吴春蕾; 段先健; 张泽平; 容敏智

doi:10.11777/j.issn1000-3304.2025.25298

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基于Diels-Alder键的可注塑、可回收、高填充Al₂O₃/不饱和聚酯导热复合材料

研究论文 | 更新时间：2026-02-11

- 基于Diels-Alder键的可注塑、可回收、高填充Al₂O₃/不饱和聚酯导热复合材料
- Injectable, Recyclable, and Highly Filled Al₂O₃/Unsaturated Polyester Thermal Composites Based on Diels-Alder Bonds
- 高分子学报 2026年57卷第3期页码：666-683
- 作者机构：
  
  1.中山大学化学学院聚合物复合材料及功能材料教育部重点实验室广州 510275
  2.广东省安全生产和应急管理科学技术研究院广州 510060
  3.广州汇富研究院有限公司广州 510663
- 作者简介：
  
  E-mail: zhangzp8@mail.sysu.edu.cn
- 基金信息：
  
  国家自然科学基金(基金号 52373095);广东省重点领域研发计划项目(2023B010200007)
- DOI：10.11777/j.issn1000-3304.2025.25298
  中图分类号：
- CSTR：32057.14.GFZXB.2025.7535
- 收稿：2025-11-10，
  
  录用：2025-12-11，
  
  网络首发：2026-01-27，
  
  纸质出版：2026-03-20
- 稿件说明：
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曹园, 莫伟杰, 吴春蕾, 段先健, 张泽平, 容敏智. 基于Diels-Alder键的可注塑、可回收、高填充Al₂O₃/不饱和聚酯导热复合材料. 高分子学报, 2026, 57(3), 666-683.

Cao, Y.; Mo, W. J.; Wu, C. L.; Duan, X. J.; Zhang, Z. P.; Rong, M. Z. Injectable, recyclable, and highly filled Al₂O₃/unsaturated polyester thermal composites based on Diels-Alder bonds. Acta Polymerica Sinica (in Chinese), 2026, 57(3), 666-683.
曹园, 莫伟杰, 吴春蕾, 段先健, 张泽平, 容敏智. 基于Diels-Alder键的可注塑、可回收、高填充Al₂O₃/不饱和聚酯导热复合材料. 高分子学报, 2026, 57(3), 666-683. DOI： 10.11777/j.issn1000-3304.2025.25298. CSTR： 32057.14.GFZXB.2025.7535.

Cao, Y.; Mo, W. J.; Wu, C. L.; Duan, X. J.; Zhang, Z. P.; Rong, M. Z. Injectable, recyclable, and highly filled Al₂O₃/unsaturated polyester thermal composites based on Diels-Alder bonds. Acta Polymerica Sinica (in Chinese), 2026, 57(3), 666-683. DOI： 10.11777/j.issn1000-3304.2025.25298. CSTR： 32057.14.GFZXB.2025.7535.

摘要

随着5G通信和高端芯片等技术的快速发展，电子器件的热管理问题日益严峻. 高填充导热聚合物复合材料是实现高效散热的理想材料之一，但其开发长期受困于高填充量导致的加工流动性差、界面结合弱及不可回收等难题. 本研究基于Diels-Alder (DA)可逆共价化学，构建了一种具有可逆交联基体与动态界面键合的共价自适应复合网络. 以DA交联的不饱和聚酯为基体，并采用马来酰亚胺改性Al

为填料，实现填料与基体的DA键合，提升两者的界面相容性. 结果显示，复合材料在70 wt%高填充下仍具有良好流动性，120 ℃

平衡扭矩仅2.77 N·m，显著低于共价交联对照样. 界面DA键合减少了填料团聚，增强了应力传递，使拉伸强度达17.7 MPa，较对比体系提升38%~149%. 复合材料同时具备较高热导率(1.50 W·m

-1

·K

-1

)、自修复效率(93.2%)和可重复回收性. 该研究为发展易加工、可循环的高填充导热复合材料提供了新途径.

Abstract

With the rapid advancement of 5G communication and high-end chip technologies

thermal management in electronic devices has become increasingly critical. Highly filled thermally conductive polymer composites are considered promising candidates for efficient heat dissipation

yet their development has long been hindered by challenges such as poor processability due to high filler loading

weak interfacial adhesion

and lack of recyclability. Based on Diels-Alder (DA) reversible covalent chemistry

this study constructed a covalent adaptive composite network featuring a reversibly cross-linked matrix and dynamic interfacial bonding. Using a DA-cross-linked unsaturated polyester as the matrix and maleimide-modified Al

as the filler

DA bonding between the filler and matrix was achieved

thereby improving interfacial compatibility. The results showed that the composite maintained good fluidity even at a high filler loading of 70 wt% (balanced t

orque=2.77 N·m

120 ℃)

which was significantly lower than that of the covalently cross-linked control sample. The interfacial DA bonding reduced filler agglomeration and enhanced stress transfer

resulting in a tensile strength improvement of 38% to 149% compared with reference systems. The composite also exhibited high thermal conductivity (1.50 W·m

-1

·K

-1

)

self-healing efficiency (93.2%)

and recyclability. This research provides a new approach for developing easily processable

recyclable

and highly filled thermal conductive composites.

关键词

Keywords

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Injectable, Recyclable, and Highly Filled Al2O3/Unsaturated Polyester Thermal Composites Based on Diels-Alder Bonds

DOI：10.11777/j.issn1000-3304.2025.25298

摘要

Abstract

关键词

Keywords

references

基于Diels-Alder键的可注塑、可回收、高填充Al₂O₃/不饱和聚酯导热复合材料

Injectable, Recyclable, and Highly Filled Al₂O₃/Unsaturated Polyester Thermal Composites Based on Diels-Alder Bonds