苯并咪唑/苯并噁唑改性双马来酰亚胺树脂及其在封装基板板材中的应用

刘润泽; 丁子淳; 刘晓萱; 张嘉梓; 王锦艳; 宗立率; 韩建华; 蹇锡高

doi:10.11777/j.issn1000-3304.2026.26019

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苯并咪唑/苯并噁唑改性双马来酰亚胺树脂及其在封装基板板材中的应用

研究论文 | 更新时间：2026-04-23

- 苯并咪唑/苯并噁唑改性双马来酰亚胺树脂及其在封装基板板材中的应用
- Benzimidazole and Benzoxazole Modified Bismaleimide Resins for High-performance Electronic Substrate Laminates
- 高分子学报 2026年页码：1-13
- 作者机构：
  
  1.大连理工大学高分子材料系大连 116024
  2.航天材料及工艺研究所北京 100076
- 作者简介：
  
  E-mail: jian4616@dlut.edu.cn
- 基金信息：
- DOI：10.11777/j.issn1000-3304.2026.26019
  中图分类号：
- CSTR：32057.14.GFZXB.2026.7583
- 收稿：2026-01-27，
  
  录用：2026-03-19，
  
  网络首发：2026-04-23，
- 稿件说明：
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刘润泽, 丁子淳, 刘晓萱, 张嘉梓, 王锦艳, 宗立率, 韩建华, 蹇锡高. 苯并咪唑/苯并噁唑改性双马来酰亚胺树脂及其在封装基板板材中的应用. 高分子学报, doi: 10.11777/j.issn1000-3304.2026.26019.

Liu, R. Z.; Ding, Z. C.; Liu, X. X.; Zhang, J. Z.; Wang, J. Y.; Zong, L. S.; Han, J. H.; Jian, X. G. Benzimidazole and benzoxazole modified bismaleimide resins for high-performance electronic substrate laminates. Acta Polymerica Sinica (in Chinese), doi: 10.11777/j.issn1000-3304.2026.26019.
刘润泽, 丁子淳, 刘晓萱, 张嘉梓, 王锦艳, 宗立率, 韩建华, 蹇锡高. 苯并咪唑/苯并噁唑改性双马来酰亚胺树脂及其在封装基板板材中的应用. 高分子学报, doi: 10.11777/j.issn1000-3304.2026.26019. DOI： CSTR： 32057.14.GFZXB.2026.7583.

Liu, R. Z.; Ding, Z. C.; Liu, X. X.; Zhang, J. Z.; Wang, J. Y.; Zong, L. S.; Han, J. H.; Jian, X. G. Benzimidazole and benzoxazole modified bismaleimide resins for high-performance electronic substrate laminates. Acta Polymerica Sinica (in Chinese), doi: 10.11777/j.issn1000-3304.2026.26019. DOI： CSTR： 32057.14.GFZXB.2026.7583.

摘要

先进电子封装向薄型化与高密度发展，使基板刚性不足和热膨胀系数(CTE)失配问题凸显，亟需开发高刚性、低CTE的新型树脂体系. 本研究使用含苯并咪唑和苯并噁唑结构的二胺单体(APBIA和APBOA)，用于改性双马来酰亚胺/烯丙基酚(BDM/DABP)树脂体系. 通过示差热扫描量热(DSC)分析、流变性能测试、傅里叶变换红外光谱分析(FTIR)、动态热机械(DMA)分析、热重分析(TGA)、静态热机械(TMA)分析及力学与介电性能测试等系统研究了其固化行为与多尺度性能. 结果表明，APBIA和APBOA的引入显著促进固化反应，并通过刚性杂环与多重氢键协同作用，有效提升弯曲模量并大幅降低热膨胀系数(CTE最低达8.59×10

-6

℃

-1

). 其中，APBOA改性体系因固化动力学适中，其制备的复材板展现出优异的弯曲强度(576.1 MPa)；同时，其铜箔剥离强度提升至0.898 N·mm

-1

，5 GHz下介电损耗低至0.00829，吸水率降至0.818%. 研究表明，苯并咪唑与苯并噁唑

结构可作为高效功能单元，为开发高性能电子封装基板材料提供新思路.

Abstract

Advanced electronic packaging is moving toward thinner and higher-density designs

exacerbating issues of insufficient substrate rigidity and coefficient of thermal expansion (CTE) mismatch—driving the need for novel resin systems with high rigidity and low CTE. In this work

diamine monomers containing benzimidazole and benzoxazole moieties—namely

2-(4-aminophenyl)-5-aminobenzimidazole (APBIA) and 2-(4-aminophenyl)-5-aminobenzoxazole (APBOA)—were employed to modify a bismaleimide/allylphenol (BDM/DABP) resin system. The curing behavior and multiscale properties of the resulting composites were systematically investigated through a suite of analytical techniques

including differential scanning calorimetry (DSC)

rheology

in situ

Fourier-transform infrared spectroscopy (FTIR)

dynamic mechanical analysis (DMA)

thermogravimetric analysis (TGA)

thermomechanical analysis (TMA)

as well as mechanical and dielectric performance evaluations. The results demonstrate that the incorporation of APBIA and APBOA significantly accelerates the curing reaction. Moreover

the synergistic e

ffect of rigid heterocyclic structures and multiple hydrogen bonds effectively enhances the flexural modulus while substantially reducing the CTE—reaching a minimum value of 8.59×10

-6

℃

-1

. Notably

the APBOA-modified system

benefiting from its balanced curing kinetics

yields composite laminates with outstanding flexural strength (576.1 MPa). Additionally

it achieves a copper foil peel strength of 0.898 N·mm

-1

an ultralow dielectric loss of 0.00829 at 5 GHz

and a reduced water absorption of 0.818%. This study highlights that benzimidazole and benzoxazole architectures can serve as highly effective functional units

offering a promising new strategy for the development of high-performance electronic packaging substrate materials.

关键词

Keywords

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