基于剥离-吸附协同效应的氮化硼/液晶环氧复合材料导热性能研究

庞小燕; 张泽平; 容敏智

doi:10.11777/j.issn1000-3304.2025.25235

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基于剥离-吸附协同效应的氮化硼/液晶环氧复合材料导热性能研究

研究论文 | 更新时间：2026-01-19

- 基于剥离-吸附协同效应的氮化硼/液晶环氧复合材料导热性能研究
- Thermal Conductivity of Boron Nitride/Liquid Crystal Epoxy Composites via Synergistic Exfoliation-adsorption Effects
- 高分子学报 2025年56卷第12期页码：2452-2468
- 作者机构：
  
  中山大学化学学院聚合物复合材料及功能材料教育部重点实验室广州 510275
- 作者简介：
  
  E-mail: zhangzp8@mail.sysu.edu.cn
- 基金信息：
  
  国家自然科学基金(基金号 52373095);广东省区域联合基金重点项目(2019B1515120038);广东省重点领域研发计划(基金号 2020B010179001)
- DOI：10.11777/j.issn1000-3304.2025.25235
  中图分类号：
- CSTR：32057.14.GFZXB.2025.7484
- 收稿：2025-09-06，
  
  录用：2025-09-30，
  
  网络出版：2025-11-20，
  
  纸质出版：2025-12-20
- 稿件说明：
移动端阅览
庞小燕, 张泽平, 容敏智. 基于剥离-吸附协同效应的氮化硼/液晶环氧复合材料导热性能研究. 高分子学报, 2025, 56(12), 2452-2468

Pang, X. Y.; Zhang, Z. P.; Rong, M. Z. Thermal conductivity of boron nitride/liquid crystal epoxy composites via synergistic exfoliation-adsorption effects. Acta Polymerica Sinica, 2025, 56(12), 2452-2468
庞小燕, 张泽平, 容敏智. 基于剥离-吸附协同效应的氮化硼/液晶环氧复合材料导热性能研究. 高分子学报, 2025, 56(12), 2452-2468 DOI： 10.11777/j.issn1000-3304.2025.25235. CSTR： 32057.14.GFZXB.2025.7484.

Pang, X. Y.; Zhang, Z. P.; Rong, M. Z. Thermal conductivity of boron nitride/liquid crystal epoxy composites via synergistic exfoliation-adsorption effects. Acta Polymerica Sinica, 2025, 56(12), 2452-2468 DOI： 10.11777/j.issn1000-3304.2025.25235. CSTR： 32057.14.GFZXB.2025.7484.

摘要

随着电子器件向微型化、高频化方向发展，开发兼具高导热性和优异力学性能的聚合物基复合材料成为热管理领域的研究重点. 六方氮化硼(h-BN)因其层状结构和超高面内热导率被视为理想填料，但其易团聚和界面相容性差的问题极大限制了其应用. 本工作提出一种剥离-吸附协同策略，通过原位球磨工艺制备h-BN/液晶环氧树脂复合材料，以增加h-BN的长径比、比表面积和界面相容性. 实验结果表明，球磨剥离显著提高了h-BN的长径比和比表面积，促进了其在基体中的分散和其表面对液晶分子的有序吸附. 当h-BN含量为20 wt%时，复合材料的面内和面外热导率分别达到7.30和1.64 W·m

-1

·K

-1

，较简单共混样品提高22.7%和82.2%. 分子动力学模拟和有限元分析进一步揭示了h-BN剥离分层的增效机制：低含量时，剥离通过增大比表面积和长径比增强界面吸附并形成导热通路；高含量时，h-BN由于相互搭接削弱了球磨剥离的导热增强效果. 此外，增强的界面相互作用也赋予了原位球磨复材更高的弯曲强度和弯曲模量. 本工作为开发高导热和高机械强度的h-BN/液晶环氧复合材料提供了理论依据.

Abstract

With the miniaturization and high-frequency development of electronic devices

polymer-based composites with high thermal conductivity and excellent mechanical properties have become a research priority in thermal management. Hexagonal boron nitride (h-BN)

with its layered structure and ultrahigh in-plane thermal conductivity

is considered an ideal filler; however

its agglomeration and poor interface compatibility severely limit its practical applications. This study proposed a synergistic exfoliation-adsorption strategy to fabricate h-BN/LC epoxy composites

via in situ

ball milling

aiming to enhance the aspect ratio

specific surfa

ce area

and interfacial compatibility of h-BN. The experimental results demonstrated that ball-milling exfoliation significantly enhanced the aspect ratio and specific surface area of h-BN

improving its dispersion and promoting the ordered adsorption of liquid crystal molecules. At 20 wt% h-BN loading

the composites achieved in-plane and through-plane thermal conductivities of 7.30 and 1.64 W·m

-1

·K

-1

representing 22.7% and 82.2% improvements over conventional blended samples

respectively. Molecular dynamics simulations and finite element analysis further revealed the enhancement mechanisms: at low filler content

exfoliation amplified interfacial adsorption and constructs thermal pathways by increasing the surface area and aspect ratio

whereas spontaneous h-BN stacking at high content diminished these benefits. Additionally

the strengthened interfacial interactions endowed the ball-milled composites with superior flexural strength and modulus at 20 wt% loading. This study provides theoretical guidance for developing h-BN/LC epoxy composites with high thermal conductivity and mechanical strength.

关键词

Keywords

references

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