基于最小热阻路径的聚合物/片状填料复合材料导热模型研究

何璐; 傅强; 吴凯

doi:10.11777/j.issn1000-3304.2026.26006

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基于最小热阻路径的聚合物/片状填料复合材料导热模型研究

研究论文 | 更新时间：2026-05-08

- 基于最小热阻路径的聚合物/片状填料复合材料导热模型研究
- Thermal Conductivity Modeling for Platelet-filled Polymer Composites Based on the Least Thermal Resistance Pathway
- 高分子学报 2026年57卷第5期页码：1055-1070
- 作者机构：
  
  四川大学高分子科学与工程学院先进高分子材料全国重点实验室成都 610065
- 作者简介：
  
  E-mail: kaiwu@scu.edu.cn
- 基金信息：
  
  国家自然科学青年科学基金(B类)(基金号 52522304)
- DOI：10.11777/j.issn1000-3304.2026.26006
  中图分类号：
- CSTR：32057.14.GFZXB.2026.7565
- 收稿：2026-01-06，
  
  录用：2026-02-13，
  
  网络首发：2026-04-01，
  
  纸质出版：2026-05-20
- 稿件说明：
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何璐, 傅强, 吴凯. 基于最小热阻路径的聚合物/片状填料复合材料导热模型研究. 高分子学报, 2026, 57(5), 1055-1070.

He, L.; Fu, Q.; Wu, K. Thermal conductivity modeling for platelet-filled polymer composites based on the least thermal resistance pathway. Acta Polymerica Sinica (in Chinese), 2026, 57(5), 1055-1070.
何璐, 傅强, 吴凯. 基于最小热阻路径的聚合物/片状填料复合材料导热模型研究. 高分子学报, 2026, 57(5), 1055-1070. DOI： 10.11777/j.issn1000-3304.2026.26006. CSTR： 32057.14.GFZXB.2026.7565.

He, L.; Fu, Q.; Wu, K. Thermal conductivity modeling for platelet-filled polymer composites based on the least thermal resistance pathway. Acta Polymerica Sinica (in Chinese), 2026, 57(5), 1055-1070. DOI： 10.11777/j.issn1000-3304.2026.26006. CSTR： 32057.14.GFZXB.2026.7565.

摘要

基于有效介质理论的传统导热模型建立在单一颗粒的假设之上，难以刻画填料粒子因距离靠近产生的相互作用及其引起的热流方向变化，因此无法有效表达导热逾渗行为，在高填充条件下预测偏差显著. 为此，我们前期提出了基于最小热阻路径理论的导热模型，通过约束热流沿体系中总热阻最小的路径传递，实现了对高填充聚合物/类球形填料复合体系热导率的准确预测. 在此基础上，本研究进一步将最小热阻路径的思想拓展至片状填料复合体系. 通过将高度无序、空间关联复杂的片状填料分布等效为可解析的简化热阻网络结构，并引入最小热阻路径理论的方向性选择机制，刻画热流的矢量属性，从而能够有效捕捉由片状填料彼此靠近、搭接及网络贯通所引起的逾渗及各向异性导热行为. 通过跨材料体系的实验数据验证，该模型在超过200组片状填料复合材料数据上的拟合度达到0.98，平均相对误差仅为11.54%，预测范围覆盖至50 vol%，基本涵盖当前可加工的片状填料复合材料体系. 该模型为聚合物/片状填料复合材料体系导热性能的预测提供了一种高效可靠的工具，也为理解聚合物复合材料的导热逾渗行为提供了一定的理论依据.

Abstract

Conventional thermal conduction models based on effective medium theory are typically established under the single-particle assumption

which makes it difficult to capture interparticle interactions arising from reduced filler spacing and the resulting changes in heat-flux directionality. Consequently

these models fail to adequately describe thermal percolation behavior and exhibit pronounced prediction deviations at high filler loadings. To address this limitation

the authors previously proposed a thermal conduction model based on the least resistance pathway theory. By constraining heat flux to propagate preferentially along pathways with the lowest overall thermal resistance

the model enabled accurate prediction of the effective thermal conductivity of highly filled polymer/quasi-spherical filler composites. Building upon this framework

the present study further extends the least resistance pathway concept to platelet-based composites. By equivalently mapping the highly disordered platelet filler distributions with complex spatial correlations into an analytically tractable simplified thermal resistance network

and by introducing a directional selection mechanism inherent to the least thermal resistance path theory

the vectorial nature of heat flux is explicitly captured. As a result

the proposed model effectively describes thermal percolation and anisotropic heat conduction behavior induced by platelet proximity

overlap

and network formation. Validation against experimental data across multiple materials demonstrates that the proposed model achieves a fitting coefficient of 0.98 over more than 200 datasets of platelet-filled polymer composites

with an average relative error of only 11.54%. The predictive capability extends to filler loadings of up to 50 vol%

covering the majority of currently processable platelet-based composites. This model thus provides an efficient and reliable tool for predicting the thermal performance of polymer/platelet filler composites and offers theoretical insight into thermal percolation phenomena in polymer composites.

关键词

Keywords

references

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