基于类哑铃结构填料增强聚合物复合材料导热性能

周晓萌; 周雪颖; 张志兴; 秦盟盟; 封伟

doi:10.11777/j.issn1000-3304.2026.26142

您当前的位置：

首页 >

文章列表页 >

基于类哑铃结构填料增强聚合物复合材料导热性能

研究论文 | 更新时间：2026-06-17

- 基于类哑铃结构填料增强聚合物复合材料导热性能
- Enhanced Thermal Conductivity of Polymer Composites Based on Dumbbell-like Filler Structures
- 高分子学报 2026年页码：1-13
- 作者机构：
  
  1.天津大学材料科学与工程学院
  2.贵金属功能材料全国重点实验室天津 300350
- 作者简介：
  
  E-mail: qmm@tju.edu.cn
  E-mail: weifeng@tju.edu.cn
- 基金信息：
  
  国家自然科学基金(U25A20254;52130303;52173078;52327802)
- DOI：10.11777/j.issn1000-3304.2026.26142
  中图分类号：
- CSTR：32057.14.GFZXB.2026.7634
- 收稿：2026-04-27，
  
  录用：2026-05-20，
  
  网络首发：2026-06-17，
- 稿件说明：
移动端阅览
周晓萌, 周雪颖, 张志兴, 秦盟盟, 封伟. 基于类哑铃结构填料增强聚合物复合材料导热性能. 高分子学报, doi: 10.11777/j.issn1000-3304.2026.26142.

Zhou, X. M.; Zhou, X. Y.; Zhang, Z. X.; Qin, M. M.; Feng, W. Enhanced thermal conductivity of polymer composites based on dumbbell-like filler structures. Acta Polymerica Sinica (in Chinese), doi: 10.11777/j.issn1000-3304.2026.26142.
周晓萌, 周雪颖, 张志兴, 秦盟盟, 封伟. 基于类哑铃结构填料增强聚合物复合材料导热性能. 高分子学报, doi: 10.11777/j.issn1000-3304.2026.26142. DOI： CSTR： 32057.14.GFZXB.2026.7634.

Zhou, X. M.; Zhou, X. Y.; Zhang, Z. X.; Qin, M. M.; Feng, W. Enhanced thermal conductivity of polymer composites based on dumbbell-like filler structures. Acta Polymerica Sinica (in Chinese), doi: 10.11777/j.issn1000-3304.2026.26142. DOI： CSTR： 32057.14.GFZXB.2026.7634.

摘要

高功率密度电子器件运行过程中产生的局部热积累会降低器件性能和服役可靠性，因此发展高效聚合物基热管理材料具有重要意义. 提高导热填料含量通常可有效改善聚合物基复合材料的导热性能，但过高的填料添加量往往会削弱材料的力学性能、电磁性能和绝缘性能等. 因此，在有限填料用量条件下提高其结构贡献和传热效能，对于聚合物基热管理复合材料导热性能的改善具有重要意义. 基于填料几何结构拓扑优化，建立了一种聚合物基复合材料导热性能提升策略，旨在通过合理调控填料构型提高其热贡献效率. 系统考察了迭代次数、体积分数、设计域几何形状和目标函数等因素对优化构型及传热性能的影响，在此基础上构建了一种简化的类哑铃填料结构. 与传统圆柱状填料结构相比，该结构表现出更优异的热响应特性，所制备的类哑铃阵列石墨/聚二甲基硅氧烷(graphite/polydimethylsiloxane，graphite/PDMS)复合材料散热效率为圆柱阵列graphite/PDMS复合材料的1.47倍. 相关结果为高性能聚合物基热管理复合材料的填料结构设计提供了有效方法.

Abstract

With the increasing power density of electronic devices

efficient thermal management is essential for improving device reliability. Polymer-based composites are promising thermal management materials because of their low density

good processability

and structural flexibility. However

the low intrinsic thermal conductivity of polymer matrices limits their heat dissipation capability. Increasing filler loading can improve heat conduction

but excessive filler content often deteriorates mechanical

electrical insulating

and processing properties. Therefore

improving filler utilization efficiency at a moderate filler fraction is important. In this work

topology optimization was used to guide the design of graphite filler structures in polydimethylsiloxane (PDMS) composites. Based on finite element simulations

a simple dumbbell-shaped graphite filler was proposed. This structure contained a continuous central heat-conduction path and expanded end regions

which could reduce through-plane thermal resistance and promote lateral heat spreading. Graphite/PDMS composites with cubic

cylindrical

frustum-like

and dumbbell-shaped fillers were fabricated by computer numerical control machining

followed by PDMS encapsulation and curing. Infrared thermal imaging and heat-flow-based tests were used to evaluate their thermal responses. Compared with conventional cylindrical and cubic fillers

the dumbbell-shaped filler produced a more uniform temperature distribution and stronger hotspot suppression. Under vacuum conditions

the hot-cold side temperature difference was reduced by 8.6 and 5.4 ℃

respectively. The dumbbell-array composite showed a heat dissipation efficiency of 0.028 W·℃⁻

1.47 times that of the cylindrical-array composite. This work provides an effect

ive strategy for designing conductive filler architectures in polymer-based thermal management composites.

关键词

Keywords

references

Sun Y. ; Su Y. T. ; Chai Z. Y. ; Jiang L. ; Heng L. P. Flexible solid-liquid bi-continuous electrically and thermally conductive nanocomposite for electromagnetic interference shielding and heat dissipation . Nat. Commun. , 2024 , 15 , 7290 . doi: 10.1038/s41467-024-51732-9 http://dx.doi.org/10.1038/s41467-024-51732-9

Wang Z. F. ; Wu Z. J. ; Weng L. ; Ge S. B. ; Jiang D. W. ; Huang M. N. ; Mulvihill D. M. ; Chen Q. G. ; Guo Z. H. ; Jazzar A. ; He X. M. ; Zhang X. H. ; Xu B. B. A roadmap review of thermally conductive polymer composites: critical factors , progress, and prospects. Adv. Funct. Mater., 2023 , 33 ( 36 ), 2301549 . doi: 10.1002/adfm.202301549 http://dx.doi.org/10.1002/adfm.202301549

Cheng R. ; Wang Q. X. ; Wang Z. X. ; Jing L. ; Garcia-Caraveo A. V. ; Li Z. ; Zhong Y. B. ; Liu X. ; Luo X. ; Huang T. Y. ; Yun H. S. ; Salihoglu H. ; Russell L. ; Kazem N. ; Chen T. Y. ; Shen S. Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling . Nat. Commun. , 2025 , 16 , 794 . doi: 10.1038/s41467-025-56163-8 http://dx.doi.org/10.1038/s41467-025-56163-8

Liu X. R. ; Wen J. W. ; Xu R. ; Huang M. Z. ; Huang J. J. ; Lin W. B. ; Luo M. ; Bohm S. ; Snyder G. J. ; Lin Y. Flexible rubber with metal-like thermal conductivity achieved via hydrogen bonding engineering . Nat. Commun. , 2026 , 17 ( 1 ), 4480 . doi: 10.1038/s41467-026-71056-0 http://dx.doi.org/10.1038/s41467-026-71056-0

Han G. J. ; Cheng H. L. ; Feng Y. Z. ; Zhang S. L. ; Dong J. W. ; Zhou B. ; Liu X. H. ; Liu C. T. ; Tao G. M. ; Shen C. Y. Efficient thermal management of electronic devices by constructing interlayer phonon bridges . Nat. Commun. , 2025 , 16 , 10533 . doi: 10.1038/s41467-025-65554-w http://dx.doi.org/10.1038/s41467-025-65554-w

Gao S. Y. ; Guo H. ; Guo Y. Q. ; Qiu H. ; Gong W. ; Gu J. W. Superior through-plane thermal conductivity in carbon fibers/spherical graphene/epoxy laminated composites for low-altitude aircrafts . InfoMat , 2026 , 8 ( 6 ), e 70139 . doi: 10.1002/inf2.70139 http://dx.doi.org/10.1002/inf2.70139

Yang X. T. ; Zhong X. ; Zhang J. L. ; Gu J. W. Intrinsic high thermal conductive liquid crystal epoxy film simultaneously combining with excellent intrinsic self-healing performance . J. Mater. Sci. Technol. , 2021 , 68 , 209 - 215 . doi: 10.1016/j.jmst.2020.08.027 http://dx.doi.org/10.1016/j.jmst.2020.08.027

Luo B. Y. ; Liang X. L. ; Ruan H. ; Li Y. Q. ; Wen Z. Bioinspired asymmetric porous natural rubber films: wearables for electromagnetic shielding , fetal monitoring, and personal thermal management. Adv. Funct. Mater., 2026 , 36 ( 22 ), e 21742 . doi: 10.1002/adfm.202521742 http://dx.doi.org/10.1002/adfm.202521742

Wang H. ; Xing W. ; Chen S. ; Song C. ; Dickey M. D. ; Deng T. Flexible and stretchable thermally conductive materials for thermal management of soft electronics . Advanced Materials ,: ■-■. doi: 10.1002/adma.202103104 http://dx.doi.org/10.1002/adma.202103104

Cheng B. ; University N. P. ; Ruan K. P. ; University N. P. ; Li M. K. ; University N. P. ; Gong W. ; University G. N. ; Guo Y. Q. ; University N. P. ; Loh X. J. ; Gu J. W. ; University N. P. Improved intrinsic thermal conductivity of highly crystalline polyimide films by regulating aggregation structures . Macromolecules , 2026 , 59 ( 4 ), 2601 - 2612 . doi: 10.1021/acs.macromol.5c02994 http://dx.doi.org/10.1021/acs.macromol.5c02994

Pang K. ; Xia Y. X. ; Liu X. T. ; Tong W. H. ; Li X. T. ; Li C. Y. ; Zhao W. B. ; Chen Y. ; Qin H. S. ; Fang W. Z. ; Peng L. ; Liu Y. L. ; Gao W. W. ; Xu Z. ; Liu Y. J. ; Gao C. Dome-celled aerogels with ultrahigh-temperature superelasticity over 2273 K. Science , 2025 , 389 ( 6757 ), 290 - 294 . doi: 10.1126/science.adw5777 http://dx.doi.org/10.1126/science.adw5777

Zhang L. Y. ; Wang M. H. ; Jeon D. ; Meng Y. Q. ; Lee S. H. ; Choe M. ; Li Y. Q. ; Wang M. R. ; Lu S. J. ; Lee Z. ; Seong W. K. ; Ruoff R. S. Synthesis and properties of mirror-like large-grain graphite films . Nat. Commun. , 2025 , 16 , 7180 . doi: 10.1038/s41467-025-62227-6 http://dx.doi.org/10.1038/s41467-025-62227-6

He M. K. ; Zhong X. ; Lu X. H. ; Hu J. W. ; Ruan K. P. ; Guo H. ; Zhang Y. L. ; Guo Y. Q. ; Gu J. W. Excellent low-frequency microwave absorption and high thermal conductivity in polydimethylsiloxane composites endowed by hydrangea-like CoNi@BN heterostructure fillers . Adv. Mater. , 2024 , 36 ( 48 ), 2410186 . doi: 10.1002/adma.202410186 http://dx.doi.org/10.1002/adma.202410186

Shi X. T. ; Zhang R. H. ; Ruan K. P. ; Ma T. B. ; Guo Y. Q. ; Gu J. W. Improvement of thermal conductivities and simulation model for glass fabrics reinforced epoxy laminated composites via introducing hetero-structured BNN-30@BNNS fillers . J. Mater. Sci. Technol. , 2021 , 82 , 239 - 249 . doi: 10.1016/j.jmst.2021.01.018 http://dx.doi.org/10.1016/j.jmst.2021.01.018

Wu W. J. ; Fan J. F. ; Zeng C. ; Cheng X. X. ; Liu X. W. ; Guo S. F. ; Sun R. ; Ren L. L. ; Hao Z. F. ; Zeng X. L. Soft , tough, antifatigue fracture elastomer composites with low thermal resistance through synergistic crack pinning and interfacial slippage. Adv. Mater., 2024 , 36 ( 40 ), 2403661 . doi: 10.1002/adma.202403661 http://dx.doi.org/10.1002/adma.202403661

Liu Y. ; Zou W. Z. ; Zhao N. ; Xu J. Electrically insulating PBO/MXene film with superior thermal conductivity , mechanical properties, thermal stability, and flame retardancy. Nat. Commun., 2023 , 14 ( 1 ), 5342 . doi: 10.1038/s41467-023-40707-x http://dx.doi.org/10.1038/s41467-023-40707-x

He Q. X. ; Qin M. M. ; Zhang H. ; Yue J. W. ; Peng L. Q. ; Liu G. J. ; Feng Y. Y. ; Feng W. Patterned liquid metal embedded in brush-shaped polymers for dynamic thermal management . Mater. Horiz. , 2024 , 11 ( 2 ), 531 - 544 . doi: 10.1039/d3mh01498c http://dx.doi.org/10.1039/d3mh01498c

Guo Y. Q. ; Ruan K. P. ; Wang G. S. ; Gu J. W. Advances and mechanisms in polymer composites toward thermal conduction and electromagnetic wave absorption . Sci. Bull. , 2023 , 68 ( 11 ), 1195 - 1212 . do i: 10.1016/j.scib.2023.04.036 http://dx.doi.org/10.1016/j.scib.2023.04.036

Yu H. T. ; Guo P. L. ; Qin M. M. ; Han G. Y. ; Chen L. ; Feng Y. Y. ; Feng W. Highly thermally conductive polymer composite enhanced by two-level adjustable boron nitride network with leaf venation structure . Compos. Sci. Technol. , 2022 , 222 , 109406 . doi: 10.1016/j.compscitech.2022.109406 http://dx.doi.org/10.1016/j.compscitech.2022.109406

Qin M. M. ; Xu Y. X. ; Cao R. ; Feng W. ; Chen L. Efficiently controlling the 3D thermal conductivity of a polymer nanoc omposite via a hyperelastic double-continuous network of graphene and sponge . Adv. Funct. Mater. , 2018 , 28 ( 45 ), 1805053 . doi: 10.1002/adfm.201870324 http://dx.doi.org/10.1002/adfm.201870324

Ma T. B. ; Ruan K. P. ; Guo Y. Q. ; Shi X. T. ; Xu B. B. ; Gu J. W. Thermal conduction pathways with specific angles and distributions to improve the thermal conductivity of copper wire/poly(lactic acid) composites . J. Mater. Sci. Technol. , 2026 , 262 , 261 - 269 . doi: 10.1016/j.jmst.2025.10.041 http://dx.doi.org/10.1016/j.jmst.2025.10.041

Jiang H. ; Xie Y. H. ; He M. K. ; Li J. D. ; Wu F. ; Guo H. ; Guo Y. Q. ; Xie D. L. ; Mei Y. ; Gu J. W. Highly thermally conductive and flame-retardant waterborne polyurethane composites with 3D BNNS bridging structures via magnetic field assistance . Nano Micro Lett. , 2025 , 17 ( 1 ), 138 . doi: 10.1007/s40820-025-01651-1 http://dx.doi.org/10.1007/s40820-025-01651-1

Ruan K. P. ; Shi X. T. ; Zhang Y. L. ; Guo Y. Q. ; Zhong X. ; Gu J. W. Electric-field-induced alignment of functionalized carbon nanotubes inside thermally conductive liquid crystalline polyimide composite films . Angew. Chim. Int. Ed. , 2023 , 62 ( 38 ), e 202309010 . doi: 10.1002/anie.202309010 http://dx.doi.org/10.1002/anie.202309010

Zhang H. ; He Q. X. ; Yu H. T. ; Qin M. M. ; Feng Y. Y. ; Feng W. A bioinspired polymer-based composite displaying both strong adhesion and anisotropic thermal conductivity . Adv. Funct. Mater. , 2023 , 33 ( 18 ), 2211985 . doi: 10.1002/adfm.202211985 http://dx.doi.org/10.1002/adfm.202211985

Xu K. ; Wang Y. D. ; Zhang Z. B. ; Li M. H. ; Yang R. J. ; Guo Y. Y. ; Zhang J. X. ; Zhu B. D. ; Zhou Y. W. ; Wang X. Y. ; Qin Y. ; Li L. H. ; Cai T. ; Dai W. ; Lin C. T. ; Nishimura K. ; Wu X. F. ; Jiang N. ; Yu J. H. Magnetic field-oriented one-step fabrication of metal-grade thermally conductive carbon fiber flexible thermal pad . Adv. Funct. Mater. , 2025 , 35 ( 43 ), 2505225 . doi: 10.1002/adfm.202505225 http://dx.doi.org/10.1002/adfm.202505225

Alexis L. ; Lee J. ; Alvarez G. A. ; Awale S. ; Jesus D. S. ; Lizcano M. ; Tian Z. T. Significantly enhanced thermal conductivity of hBN/PTFE composites: A comprehensive study of filler size and dispersion . ACS Appl. Mater. Interfaces , 2024 , 16 ( 22 ), 29042 - 29048 . doi: 10.1021/acsami.4c03818 http://dx.doi.org/10.1021/acsami.4c03818

Qi W. ; Liu M. ; Wu J. L. ; Xie Q. ; Chen L. ; Yang X. ; Shen B. Y. ; Bian X. M. ; Song W. L. Promoting the thermal transport via understanding the intrinsic relation between thermal conductivity and interfacial contact probability in the polymeric composites with hybrid fillers . Compos. Part B Eng. , 2022 , 232 , 109613 . doi: 10.1016/j.compositesb.2022.109613 http://dx.doi.org/10.1016/j.compositesb.2022.109613

Ma X. ; Zhang H. T. ; Guo Y. Q. ; He M. K. ; Guo H. ; Liu Z. Y. ; Jing X. R. ; Zheng X. X. ; Liu Y. J. ; Bai S. L. ; Shi X. T. ; Wang J. T. ; Gu J. W. Enhancing thermal conductivity in polysiloxane composites through synergistic design of liquid crystals and boron nitride nanosheets . J. Mater. Sci. Technol. , 2025 , 231 , 54 - 61 . doi: 10.1016/j.jmst.2025.01.004 http://dx.doi.org/10.1016/j.jmst.2025.01.004

Yan Q. W. ; Dai W. ; Gao J. Y. ; Tan X. ; Lv L. ; Ying J. F. ; Lu X. X. ; Lu J. B. ; Yao Y. G. ; Wei Q. P. ; Sun R. ; Yu J. H. ; Jiang N. ; Chen D. ; Wong C. P. ; Xiang R. ; Maruyama S. ; Lin C. T. Ultrahigh-aspect-ratio boron nitride nanosheets leading to superhigh in-plane thermal conductivity of foldable heat spreader . ACS Nano , 2021 , 15 ( 4 ), 6489 - 6498 . doi: 10.1021/acsnano.0c09229 http://dx.doi.org/10.1021/acsnano.0c09229

Luo M. N. ; Yang T. ; Wang T. ; Yan Z. ; Zhang J. The effect of filler size on the properties of TPU/BN flexible thermal conductive composites prepared by Fused Filament Fabrication . Polymer , 2024 , 296 , 126810 . doi: 10.1016/j.polymer.2024.126810 http://dx.doi.org/10.1016/j.polymer.2024.126810

Jin Y. C. ; Ye L. J. ; Chai Y. C. ; Hong J. H. ; Li Y. J. Tailoring asymmetric filler arrangement by hollow glass microspheres towards polymer composites with improved through-plane thermal conductivity . Compos. Sci. Technol. , 2023 , 233 , 109904 . doi: 10.1016/j.compscitech.2022.109904 http://dx.doi.org/10.1016/j.compscitech.2022.109904

Song M. X. ; Chen K. ; Zhang X. Optimization of the volume-to-point heat conduction problem with automatic differentiation based approach . Int. J. Heat Mass Transf. , 2021 , 177 , 121552 . doi: 10.1016/j.ijheatmasstransfer.2021.121552 http://dx.doi.org/10.1016/j.ijheatmasstransfer.2021.121552

Sha W. ; Xiao M. ; Huang M. Z. ; Gao L. Topology-optimized freeform thermal metamaterials for omnidirectionally cloaking sensors . Mater. Today Phys. , 2022 , 28 , 100880 . doi: 10.1016/j.mtphys.2022.100880 http://dx.doi.org/10.1016/j.mtphys.2022.100880

Chen, J. Y.; Su, R. Y.; Zhang, X. Q.; Li, Y.; He, R. J. 3 D printed leaf-vein-like Al 2 O 3 /EP biohybrid structures with enhanced thermal conductivity. ACS Appl . Mater . Interfaces , 2024 , acsami. 4 c 14564 . doi: 10.1021/acsami.4c14564 http://dx.doi.org/10.1021/acsami.4c14564

Xiao M. ; Sha W. ; Zhang Y. ; Liu X. L. ; Li P. G. ; Gao L. CMTO: Configurable-design-element multiscale topology optimization . Addit. Manuf. , 2023 , 69 , 103545 . doi: 10.1016/j.addma.2023.103545 http://dx.doi.org/10.1016/j.addma.2023.103545

Sun S. C. ; Rankouhi B. ; Thoma D. J. ; Cheadle M. J. ; Maples G. D. ; Anderson M. H. ; Nellis G. ; Qian X. P. Topology optimization, additive manufacturing and thermohydraulic testing of heat sinks . Int. J. Heat Mass Transf. , 2024 , 224 , 125281 . doi: 10.1016/j.ijheatmasstransfer.2024.125281 http://dx.doi.org/10.1016/j.ijheatmasstransfer.2024.125281

Sha W. ; Hu R. ; Xiao M. ; Chu S. ; Zhu Z. ; Qiu C. W. ; Gao L. Topology-optimized thermal metamaterials traversing full-parameter anisotropic space . npj Comput. Mater. , 2022 , 8 , 179 . doi: 10.1038/s41524-022-00861-0 http://dx.doi.org/10.1038/s41524-022-00861-0

Zhu J. H. ; Zhou H. ; Wang C. ; Zhou L. ; Yuan S. Q. ; Zhang W. H. A review of topology optimization for additive manufacturing: Status and challenges . Chin. J. Aeronaut. , 2021 , 34 ( 1 ), 91 - 110 . doi: 10.1016/j.cja.2020.09.020 http://dx.doi.org/10.1016/j.cja.2020.09.020

Liu S. T. ; Li Q. H. ; Hu J. Y. ; Chen W. J. ; Zhang Y. C. ; Luo Y. F. ; Wang Q. A survey of topology optimization methods considering manufacturable structural feature constraints for additive manufacturing structures . Addit. Manuf. Front. , 2024 , 3 ( 2 ), 200143 . doi: 10.1016/j.amf.2024.200143 http://dx.doi.org/10.1016/j.amf.2024.200143

Zhao D. L. ; Qian X. ; Gu X. K. ; Jajja S. A. ; Yang R. G. Measurement techniques for thermal conductivity and interfacial thermal conductance of bulk and thin film materials . J. Electron. Packag. , 2016 , 138 ( 4 ), 040802 . doi: 10.1115/1.4034605 http://dx.doi.org/10.1115/1.4034605

Xiao P. ; El Sachat A. ; Angel E. C. ; Ng R. C. ; Nikoulis G. ; Kioseoglou J. ; Termentzidis K. ; Sotomayor Torres C. M. ; Sledzinska M. MoS 2 phononic crystals for advanced thermal management . Sci. Adv. , 2024 , 10 ( 13 ), eadm 8825 . doi: 10.1126/sciadv.adm8825 http://dx.doi.org/10.1126/sciadv.adm8825

浏览量

下载量

CSCD

文章被引用时，请邮件提醒。

提交

工具集

关联资源

基于最小热阻路径的聚合物/片状填料复合材料导热模型研究

苯并咪唑/苯并噁唑改性双马来酰亚胺树脂及其在封装基板板材中的应用

基于恒温光热水凝胶的噬菌体-抗生素-光热多模态协同抗菌治疗

加工工艺对恒黏天然橡胶结构与性能的影响

金属有机框架基高分子抗菌材料的合成及应用研究进展