东华大学先进纤维材料全国重点实验室 材料科学与工程学院 上海 201620
E-mail: qsxu@dhu.edu.cn
收稿:2025-10-22,
录用:2025-12-01,
网络首发:2026-01-14,
纸质出版:2026-03-20
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郭卫平, 何光, 许青松, 张家霖, 李琇廷, 董杰, 赵昕, 张清华. 基于柔性酰肼的热塑性聚酰亚胺薄膜的制备及其自修复性能研究. 高分子学报, 2026, 57(3), 654-665.
Guo, W. P.; He, G.; Xu, Q. S.; Zhang, J. L.; Li, X. T.; Dong, J; Zhao, X.; Zhang, Q H. Preparation and self-healing performance study of thermoplastic polyimide films based on flexible hydrazide. Acta Polymerica Sinica (in Chinese), 2026, 57(3), 654-665.
郭卫平, 何光, 许青松, 张家霖, 李琇廷, 董杰, 赵昕, 张清华. 基于柔性酰肼的热塑性聚酰亚胺薄膜的制备及其自修复性能研究. 高分子学报, 2026, 57(3), 654-665. DOI: 10.11777/j.issn1000-3304.2025.25277. CSTR: 32057.14.GFZXB.2025.7528.
Guo, W. P.; He, G.; Xu, Q. S.; Zhang, J. L.; Li, X. T.; Dong, J; Zhao, X.; Zhang, Q H. Preparation and self-healing performance study of thermoplastic polyimide films based on flexible hydrazide. Acta Polymerica Sinica (in Chinese), 2026, 57(3), 654-665. DOI: 10.11777/j.issn1000-3304.2025.25277. CSTR: 32057.14.GFZXB.2025.7528.
聚酰亚胺(PI)材料因其优异性能被广泛应用于诸多领域. 由于材料在使用中会不可避免地受到机械损伤,因此设计开发自修复聚酰亚胺材料十分重要. 然而,本征型自修复PI存在着自愈合性能与力学性能的矛盾. 针对该问题,本研究将含有氢键给/受体的柔性己二酸二酰肼(ADH)通过三元共聚的方法引入到传统聚酰亚胺中,得到了一种具有优异机械性能和自愈合特性的热塑性聚酰亚胺(H-TPI)薄膜. 研究表明,柔性的ADH共聚后能够在相邻分子链之间形成具有温度响应性的氢键网络. 这一方面使得H-TPI的机械性能得到显著提升,抗拉强度从111.7 MPa提高至130.5 MPa. 另一方面使得聚合物分子链运动能力提高,进而赋予TPI薄膜优良的自修复能力,在260 ℃、15 MPa下,5 min即可实现高效自修复,愈合效率达到84.6%. 同时,H-TPI还具有较好的溶解性和熔融加工性. 本项研究为高性能自修复聚酰亚胺材料的设计和制备提供了一种新的思路和路径.
Polyimide (PI) materials are widely used in many fields due to their excellent properties. During service
these materials inevitably suffer from mechanical damages
which seriously impair their service performance and lifetime
and may even lead to serious accidents. Therefore
the design and development of polyimide materials with self-healing properties have become great significant. However
for intrinsic self-healing PI
there exists a trade-off between self-healing performance and mechanical properties. To address this issue
in this study
flexible adipic dihydrazide (ADH) containing hydrogen bond donors/acceptors was introduced into traditional polyimide
via
ternary polycondensation
resulting in a hydrogen bond-containing thermoplastic polyimide (H-TPI) film that combines excellent mechanical properties and self-healing capabilities. Studies showed that after copolymerization with flexible ADH
a temperature-responsive hydrogen bond network could be formed between adjacent molecular chains. On one hand
this significantly enhanced the mechanical properties of H-TPI
with the tensile strength increasing from 111.7 MPa to 130.5 MPa. On the other hand
it improved the mobility of polymer molecular chains
thereby endowing the TPI film with excellent self-healing ability. Specifically
self-healing could be achieved within 5 min at 260
℃ and 15 MPa
with a healing efficiency of 84.6%. This research provides a new idea and approach for the design and preparation of high-performance self-healing materials.
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